P87C51MC2BA/02,529 NXP Semiconductors, P87C51MC2BA/02,529 Datasheet - Page 32

IC 80C51 MCU 96K OTP 44-PLCC

P87C51MC2BA/02,529

Manufacturer Part Number
P87C51MC2BA/02,529
Description
IC 80C51 MCU 96K OTP 44-PLCC
Manufacturer
NXP Semiconductors
Series
87Cr
Datasheet

Specifications of P87C51MC2BA/02,529

Program Memory Type
OTP
Program Memory Size
96KB (96K x 8)
Package / Case
44-PLCC
Core Processor
8051
Core Size
8-Bit
Speed
24MHz
Connectivity
EBI/EMI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
34
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Processor Series
P87C5x
Core
80C51
Data Bus Width
8 bit
Data Ram Size
3 KB
Interface Type
SPI, UART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
34
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
0 C
Cpu Family
87C
Device Core
80C51
Device Core Size
8b
Frequency (max)
24MHz
Total Internal Ram Size
3KB
# I/os (max)
34
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
CISC
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
44
Package Type
PLCC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
OM10064 - EMULATOR 80C51 PDS51-MK2
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant
Other names
568-1244-5
935273219529
P87C51MC2BA/02-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
P87C51MC2BA/02,529
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
9397 750 12302
Product data
13.4 Manual soldering
13.5 Package related soldering information
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or
265 C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 C.
Table 9:
[1]
[2]
Package
BGA, HTSSON..T
SSOP..T
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
For packages with leads on two sides and a pitch (e):
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
parallel to the transport direction of the printed-circuit board;
transport direction of the printed-circuit board.
[5]
, SO, SOJ
[3]
[1]
, TFBGA, USON, VFBGA
Suitability of surface mount IC packages for wave and reflow soldering
methods
[8]
, PMFP
Rev. 03 — 13 November 2003
[3]
, LBGA, LFBGA, SQFP,
[9]
, WQCCN..L
P87C51MB2/P87C51MC2
[8]
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
80C51 8-bit microcontroller family
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[4]
[5][6]
[7]
Reflow
suitable
suitable
suitable
suitable
suitable
not suitable
[2]
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