PIC12C671/JW Microchip Technology, PIC12C671/JW Datasheet - Page 21
![IC MCU EPROM 1KX14 A/D 8CDIP](/photos/12/23/122359/pic12c671_jw_sml.jpg)
PIC12C671/JW
Manufacturer Part Number
PIC12C671/JW
Description
IC MCU EPROM 1KX14 A/D 8CDIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(14 pages)
Specifications of PIC12C671/JW
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
EPROM, UV
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
8-CDIP (0.300", 7.62mm) Window
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Connectivity
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC12C671/JW
Manufacturer:
MICROCH
Quantity:
20 000
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1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
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