PIC16CE624-04/P Microchip Technology, PIC16CE624-04/P Datasheet - Page 98

IC MCU OTP 1KX14 EE COMP 18DIP

PIC16CE624-04/P

Manufacturer Part Number
PIC16CE624-04/P
Description
IC MCU OTP 1KX14 EE COMP 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet

Specifications of PIC16CE624-04/P

Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Oscillator Type
External
Core Processor
PIC
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Type
OTP
Eeprom Size
128 x 8
Ram Size
96 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16C
No. Of I/o's
13
Eeprom Memory Size
128Byte
Ram Memory Size
96Byte
Cpu Speed
4MHz
No. Of
RoHS Compliant
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
96 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
13
Number Of Timers
1
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16CE624-04/P
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
PIC16CE624-04/P
Quantity:
6
Part Number:
PIC16CE624-04/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC16CE624-04/P
Quantity:
536
PIC16CE62X
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS40182C-page 98
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-001
Drawing No. C04-007
*Controlling Parameter
Notes:
n
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
E1
E
eB
Dimension Limits
2
1
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
A1
A
.115
.015
.125
.045
.140
.300
.240
.890
.008
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
1999 Microchip Technology Inc.
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15

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