PIC16F610-I/P Microchip Technology, PIC16F610-I/P Datasheet - Page 150
![IC PIC MCU FLASH 1KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F610-I/P
Manufacturer Part Number
PIC16F610-I/P
Description
IC PIC MCU FLASH 1KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F609T-ISN.pdf
(26 pages)
2.PIC16F616T-ISL.pdf
(214 pages)
3.PIC16F616T-ISL.pdf
(8 pages)
4.PIC16F616-ESL.pdf
(180 pages)
Specifications of PIC16F610-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232 / USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
11
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14ACICE0207 - MPLABICE 14P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F610-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC12F609T-ISN PDF datasheet
- PIC16F616T-ISL PDF datasheet #2
- PIC16F616T-ISL PDF datasheet #3
- PIC16F616-ESL PDF datasheet #4
- Current page: 150 of 180
- Download datasheet (3Mb)
PIC16F610/616/16HV610/616
15.6
DS41288C-page 148
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
DD
JA
JC
A
DIE
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
Preliminary
85.0
46.3
32.5
31.0
31.7
Typ
100
150
2.6
70
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x4mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x4mm package
PD = P
P
(NOTE 1)
P
P
(NOTE 2)
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
© 2007 Microchip Technology Inc.
* V
DD
Conditions
OL
(T
+ P
x V
) + Σ (I
DIE
I
DD
/
- T
O
A
OH
)/θ
* (V
JA
DD
- V
OH
))
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