PIC16F610-I/P Microchip Technology, PIC16F610-I/P Datasheet - Page 149
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PIC16F610-I/P
Manufacturer Part Number
PIC16F610-I/P
Description
IC PIC MCU FLASH 1KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F609T-ISN.pdf
(26 pages)
2.PIC16F616T-ISL.pdf
(214 pages)
3.PIC16F616T-ISL.pdf
(8 pages)
4.PIC16F616-ESL.pdf
(180 pages)
Specifications of PIC16F610-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232 / USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
11
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14ACICE0207 - MPLABICE 14P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F610-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
15.5
© 2007 Microchip Technology Inc.
DC CHARACTERISTICS
D101*
D101A* C
D130
D130A
D131
D132
D133
D134
Note 1:
Param
No.
2:
3:
4:
*
†
COSC2
E
E
V
V
T
T
DC Characteristics:
PEW
RETD
P
D
PR
PEW
IO
Sym
These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
Negative current is defined as current sourced by the pin.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
Including OSC2 in CLKOUT mode.
Capacitive Loading Specs on
Output Pins
OSC2 pin
All I/O pins
Program Flash Memory
Cell Endurance
Cell Endurance
V
V
Erase/Write cycle time
Characteristic Retention
DD
DD
for Read
for Erase/Write
Characteristic
PIC16F610/616/16HV610/616-I (Industrial)
PIC16F610/616/16HV610/616-E (Extended) (Continued)
PIC16F610/616/16HV610/616
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Preliminary
V
Min
10K
4.5
1K
40
—
—
—
MIN
100K
Typ†
10K
—
—
—
—
—
2
-40°C ≤ T
-40°C ≤ T
Max
5.5
5.5
2.5
15
50
—
—
—
Units
A
A
Year Provided no other specifications
E/W -40°C ≤ T
E/W +85°C ≤ T
ms
pF
pF
≤ +85°C for industrial
≤ +125°C for extended
V
V
In XT, HS and LP modes when
external clock is used to drive
OSC1
V
voltage
are violated
MIN
= Minimum operating
A
A
Conditions
≤ +85°C
≤ +125°C
DS41288C-page 147