MCF5474VR266 Freescale Semiconductor, MCF5474VR266 Datasheet - Page 10

• Manufacturer Part Number: MCF5474VR266
• Description: IC MPU 32BIT COLDF 388-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF547xr

Specifications of MCF5474VR266

• Core Processor: Coldfire V4E
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 99
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.43 V ~ 1.58 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 388-BGA
• Family Name: MCF5xxx
• Device Core: ColdFire V4e
• Device Core Size: 32b
• Frequency (max): 266MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5/3.3V
• Operating Supply Voltage (max): 1.58/3.6V
• Operating Supply Voltage (min): 1.43/3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 388
• Package Type: BGA
• Processor Series: MCF547x
• Core: ColdFire V4
• Data Bus Width: 32 bit
• Program Memory Size: 32 KB
• Data Ram Size: 32 KB
• Interface Type: I2C, JTAG
• Maximum Clock Frequency: 83 MHz
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M5475EVBE
• Minimum Operating Temperature: 0 C
• Cpu Speed: 266MHz
• Embedded Interface Type: I2C, UART, DMA
• Digital Ic Case Style: BGA
• No. Of Pins: 388
• Rohs Compliant: Yes
• For Use With: M5475EVBGHS - KIT DEV GHS FOR M5475EVBM5474GFE - MODULE M5474 FIRE ENGINEM5474LITEKIT - KIT DEV FOR MCF547X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

Output Driver Capability and Loading
4.4.1
The USBRBIAS resistor should be placed as close to the dedicated USB 2.0 pins as possible. The tolerance should be ±1%.
5
Table 6
10
lists values for drive capability and output loading.
Output Driver Capability and Loading
Bias Resistor
1
SDRAMC (SDADDR[12:0], SDDATA[31:0], RAS, CAS, SDDM[3:0],
SDWE, SDBA[1:0]
SDRAMC DQS and clocks (SDDQS[3:0], SDRDQS, SDCLK[1:0],
SDCLK[1:0], SDCKE)
SDRAMC chip selects (SDCS[3:0])
FlexBus (AD[31:0], FBCS[5:0], ALE, R/W, BE/BWE[3:0], OE)
FEC (EnMDIO, EnMDC, EnTXEN, EnTXD[3:0], EnTXER
Timer (TOUT[3:0])
DACK[1:0]
PSC (PSCnTXD[3:0], PSCnRTS/PSCnFSYNC,
DSPI (DSPISOUT, DSPICS0/SS, DSPICS[2:3], DSPICS5/PCSS)
PCI (PCIAD[31:0], PCIBG[4:1], PCIBG0/PCIREQOUT, PCIDEVSEL,
PCICXBE[3:0], PCIFRM, PCIPERR, PCIRESET, PCISERR, PCISTOP,
PCIPAR, PCITRDY, PCIIRDY
I2C (SCL, SDA)
BDM (PSTCLK, PSTDDATA[7:0], DSO/TDO,
RSTO
The device’s pads have balanced sink and source current. The drive capability is the same as
the sink capability.
MCF547x ColdFire
Figure 7. USBRBIAS Connection
Table 6. I/O Driver Capability
Signal
USBRBIAS
®
Microprocessor, Rev. 4
9.1kΩ
1
Capability
24 mA
24 mA
16 mA
24 mA
16 mA
24 mA
Drive
8 mA
8 mA
8 mA
8 mA
8 mA
8 mA
8 mA
Load (C
Freescale Semiconductor
Output
15 pF
15 pF
15 pF
30 pF
15 pF
50 pF
30 pF
30 pF
50 pF
50 pF
50 pF
25 pF
50 pF
L
)