MCF53012CQT240 Freescale Semiconductor, MCF53012CQT240 Datasheet - Page 20
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MCF53012CQT240
Manufacturer Part Number
MCF53012CQT240
Description
MCU 32BIT COLDFIRE EMAC 208LQFP
Manufacturer
Freescale Semiconductor
Series
MCF5301xr
Datasheet
1.MCF53010CQT240.pdf
(62 pages)
Specifications of MCF53012CQT240
Core Processor
Coldfire V3
Core Size
32-Bit
Speed
240MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, PWM, WDT
Number Of I /o
61
Program Memory Size
16KB (16K x 8)
Program Memory Type
Cache
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Processor Series
MCF5301x
Core
ColdFire V3
Data Bus Width
32 bit
Data Ram Size
128 KB
Interface Type
UART, I2C, SPI, SSI, Ethernet
Maximum Clock Frequency
20 MHz to 400 MHz
Number Of Programmable I/os
61
Number Of Timers
8
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M53015EVB, M53017KIT, M53017MOD
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Preliminary Electrical Characteristics
5.2
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
20
T
Q
P
P
P
1
2
3
4
5
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
A
JMA
D
INT
I/O
θ
Freescale recommends the use of θ
device junction temperatures from exceeding the rated specification. System designers should be aware
that device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in
the customer’s system using the Ψ
EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written in conformance with Psi-JT.
Thermal Characteristics
JMA
and Ψ
= Ambient Temperature, °C
= Package Thermal Resistance, Junction-to-Ambient, °C/W
= P
= I
= Power Dissipation on Input and Output Pins — User Determined
jt
I/O
INT
DD
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
< P
× IV
+ P
INT
Characteristic
I/O
DD
and can be ignored. An approximate relationship between P
, Watts - Chip Internal Power
Preliminary—Subject to Change Without Notice
K
J
) in °C can be obtained from:
=
Table 8. Thermal Characteristics
P
jt
JmA
D
parameter, the device power dissipation, and the method described in
T
MCF5301x Data Sheet, Rev. 5
J
×
P
and power dissipation specifications in the system design to prevent
(
=
D
Four layer board
(2s2p)
Four layer board
(2s2p)
T
T
A
=
A
×
-------------------------------- -
(
+
T
273°C
(
J
P
+
D
K
273°C
×
)
Θ
+
JMA
Q
)
JMA
)
Symbol
θ
θ
×
θ
θ
Ψ
JMA
JMA
T
JB
JC
P
jt
j
2
D
MAPBGA
36
32
256
2
105
25
14
1,5
1,2
1,2
3
4
D
and T
Freescale Semiconductor
LQFP
38
33
J
208
3
105
29
11
(if P
1,5
1,2
1,2
3
4
I/O
is neglected) is:
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
C
Eqn. 1
Eqn. 2
Eqn. 3