HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 208

IC H8/SLP MCU FLASH 80QFP

HD64F38024DV

Manufacturer Part Number
HD64F38024DV
Description
IC H8/SLP MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheets

Specifications of HD64F38024DV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
LCD, PWM, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F38024DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 ROM
6.10.5
1. Auto-erase mode supports only entire memory erasing.
2. Do not perform a command write during auto-erasing.
3. Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also
4. Status polling I/O6 and I/O7 pin information is retained until the next command write. As long
5. Table 6.18 shows the AC characteristics.
Table 6.18 AC Characteristics in Auto-Erase Mode
Conditions: V
Item
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Write pulse width
Status polling start time
Status polling access time
Memory erase time
WE rise time
WE fall time
Rev. 8.00 Mar. 09, 2010 Page 186 of 658
REJ09B0042-0800
be used for this purpose (I/O7 status polling uses the auto-erase operation end decision pin).
as the next command write has not been performed, reading is possible by enabling CE and
OE.
Auto-Erase Mode
CC
= 3.3 V ±0.3 V, V
SS
Symbol
t
t
t
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
ests
spa
erase
r
f
= 0 V, T
a
= 25°C ±5°C
Min
20
0
0
50
50
70
1
100
Max
150
40000
30
30
Unit
µs
ns
ns
ns
ns
ns
ms
ns
ms
ns
ns
Notes
Figure 6.18

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