MCF52232CAF50 Freescale Semiconductor, MCF52232CAF50 Datasheet - Page 34
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MCF52232CAF50
Manufacturer Part Number
MCF52232CAF50
Description
IC MCU 32BIT 128K FLASH 80-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF5223xr
Datasheet
1.MCF52236AF50.pdf
(55 pages)
Specifications of MCF52232CAF50
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
50MHz
Connectivity
Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
56
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
Cpu Family
MCF5223x
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
50MHz
Interface Type
I2C/QSPI/UART
Total Internal Ram Size
32KB
# I/os (max)
56
Number Of Timers - General Purpose
10
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
LQFP
Processor Series
MCF522x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
32 KB
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
56
Number Of Timers
10
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M52235EVB, M52233DEMO
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF52232CAF50
Manufacturer:
FREESCAL
Quantity:
410
Company:
Part Number:
MCF52232CAF50
Manufacturer:
Freescale
Quantity:
221
Company:
Part Number:
MCF52232CAF50
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
2.4
1
2
3
4
5
6
34
Clock Source Frequency Range of EXTAL Frequency Range
PLL reference frequency range
System frequency
Loss of reference frequency
Self clocked mode frequency
Crystal start-up time
EXTAL input high voltage
EXTAL input low voltage
XTAL output high voltage
XTAL output low voltage
XTAL load capacitance
PLL lock time
Power-up to lock time
Duty cycle of reference
Frequency un-LOCK range
Frequency LOCK range
CLKOUT period Jitter
• Crystal
• External
In external clock mode, it is possible to run the chip directly from an external clock source without enabling the PLL.
Loss of reference frequency is the reference frequency detected internally that transitions the PLL into self-clocked mode.
Self-clocked mode frequency is the frequency that the PLL operates at when the reference frequency falls below f
default MFD/RFD settings.
This parameter is characterized before qualification rather than 100% tested.
Proper PC board layout procedures must be followed to achieve specifications.
All internal registers retain data at 0 Hz.
External clock mode
On-Chip PLL Frequency
Crystal reference
External reference
Crystal reference
External reference
I
I
With crystal reference
Without crystal reference
Peak-to-peak jitter (clock edge to clock edge)
Long term jitter (averaged over 2 ms interval)
OH
OL
= 1.0 mA
= 1.0 mA
1
Phase Lock Loop Electrical Specifications
5,9
2
5, 6
5, 7,9
5, 6, 8, 10,11
8
5
Characteristic
3, 5
4, 5
Table 25. Oscillator and PLL Electrical Specifications
, measured at f
MCF52235 ColdFire Microcontroller Data Sheet, Rev. 10
(V
DD
and V
DDPLL
SYS
Max
= 2.7 to 3.6 V, V
SS
Symbol
V
V
f
f
fLCK
C
crystal
f
ref_pll
f
IHEXT
V
V
f
SCM
ILEXT
t
f
LOR
= V
t
t
f
t
sys
lplk
ext
cst
lpll
UL
jitter
dc
OL
OL
SSPLL
= 0 V)
V
V
f
ref
DD
DD
–0.75
–1.5
Min
100
V
V
0.5
2.0
—
—
—
—
—
—
40
—
—
0
2
0
1
SS
SS
/ 32
- 1.0
–1.0
Freescale Semiconductor
1000
Max
25.0
60.0
10.0
10.5
0.75
0.01
V
3.0
500
500
1.0
0.8
0.5
1.5
60
60
10
60
10
—
—
5
DD
7
LOR
% f
% f
% f
% f
MHz
MHz
MHz
MHz
Unit
kHz
ms
ms
pF
s
s
V
V
V
V
with
sys
sys
sys
sys