MC9S08DZ60AMLH Freescale Semiconductor, MC9S08DZ60AMLH Datasheet - Page 371

• Manufacturer Part Number: MC9S08DZ60AMLH
• Description: IC MCU 60K FLASH 4K RAM 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08DZ60AMLH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LQFP
• Processor Series: S08DZ
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: CAN, I2C, SCI, SPI
• Number Of Programmable I/os: 53
• Number Of Timers: 2
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• A/d Bit Size: 12 bit
• A/d Channels Available: 24
• For Use With: DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
1
2
I/O
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
is neglected) is:
T
θ
P
P
P
C
D
T
D
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
Operating temperature range (packaged)
Maximum Junction Temperature
Thermal resistance
= Power dissipation on input and output pins — user determined
int
DD
+ P
Single-layer board
Four-Layer board
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
K = P
2
int
Rating
and can be neglected. An approximate relationship between P
MC9S08DZ60 Series Data Sheet, Rev. 4
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
1
) in °C can be obtained from:
64-pin LQFP
48-pin LQFP
32-pin LQFP
64-pin LQFP
48-pin LQFP
32-pin LQFP
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
)
Symbol
× (P
θ
θ
θ
θ
θ
θ
T
T
JA
JA
JA
JA
JA
JA
A
J
D
)
2
–40 to 125
–40 to 105
–40 to 85
Value
135
Appendix A Electrical Characteristics
69
75
80
51
51
52
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Temp.
Code
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
—
M
C
V
and T
371
J