MC9S08DZ60AMLH Freescale Semiconductor, MC9S08DZ60AMLH Datasheet - Page 139

• Manufacturer Part Number: MC9S08DZ60AMLH
• Description: IC MCU 60K FLASH 4K RAM 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08DZ60AMLH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LQFP
• Processor Series: S08DZ
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: CAN, I2C, SCI, SPI
• Number Of Programmable I/os: 53
• Number Of Timers: 2
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• A/d Bit Size: 12 bit
• A/d Channels Available: 24
• For Use With: DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.1.2
There are nine modes of operation for the MCG:
For details see
8.2
There are no MCG signals that connect off chip.
Freescale Semiconductor
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FLL Engaged Internal (FEI)
FLL Engaged External (FEE)
FLL Bypassed Internal (FBI)
FLL Bypassed External (FBE)
PLL Engaged External (PEE)
PLL Bypassed External (PBE)
Bypassed Low Power Internal (BLPI)
Bypassed Low Power External (BLPE)
Stop
External Signal Description
Modes of Operation
Section 8.4.1, “Operational
MC9S08DZ60 Series Data Sheet, Rev. 4
Modes.
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
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