C8051F311-GM Silicon Laboratories Inc, C8051F311-GM Datasheet - Page 115

IC 8051 MCU 16K FLASH 28MLP

C8051F311-GM

Manufacturer Part Number
C8051F311-GM
Description
IC 8051 MCU 16K FLASH 28MLP
Manufacturer
Silicon Laboratories Inc
Series
C8051F31xr
Datasheets

Specifications of C8051F311-GM

Program Memory Type
FLASH
Program Memory Size
16KB (16K x 8)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
25
Ram Size
1.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 17x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
1.25 KB
Interface Type
I2C, SMBus, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
25
Number Of Timers
4 bit
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F310DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 17 Channel
No. Of I/o's
25
Ram Memory Size
1280Byte
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Package
24QFN EP
Device Core
8051
Family Name
C8051F31x
Maximum Speed
25 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1446 - ADAPTER PROGRAM TOOLSTICK F311336-1253 - DEV KIT FOR C8051F310/F311
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1254

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Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F311-GM
Manufacturer:
SILICONLABS/芯科
Quantity:
20 000
Part Number:
C8051F311-GMR
Manufacturer:
SILICON LABS/芯科
Quantity:
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C8051F311-GMR
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Part Number:
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Quantity:
441
10.4. Flash Write and Erase Guidelines
Any system which contains routines which write or erase Flash memory from software involves some risk
that the write or erase routines will execute unintentionally if the CPU is operating outside its specified
operating range of V
fying code can result in alteration of Flash memory contents causing a system failure that is only recover-
able by re-Flashing the code in the device.
The following guidelines are recommended for any system that contains routines which write or erase
Flash from code.
10.4.1. V
10.4.2. PSWE Maintenance
1. If the system power supply is subject to voltage or current "spikes," add sufficient transient
2. Make certain that the minimum V
3. Enable the on-chip V
4. As an added precaution, explicitly enable the V
5. Make certain that all writes to the RSTSRC (Reset Sources) register use direct assignment
6. Make certain that all writes to the RSTSRC register explicitly set the PORSF bit to a '1'. Areas
7. Reduce the number of places in code where the PSWE bit (b0 in PSCTL) is set to a '1'. There
8. Minimize the number of variable accesses while PSWE is set to a '1'. Handle pointer address
9. Disable interrupts prior to setting PSWE to a '1' and leave them disabled until after PSWE has
DD
protection devices to the power supply to ensure that the supply voltages listed in the Absolute
Maximum Ratings table are not exceeded.
meet this rise time specification, then add an external V
the device that holds the device in reset until V
drops below 2.7 V.
as possible. This should be the first set of instructions executed after the Reset Vector. For 'C'-
based systems, this will involve modifying the startup code added by the 'C' compiler. See your
compiler documentation for more details. Make certain that there are no delays in software
between enabling the V
examples showing this can be found in "AN201: Writing to Flash from Firmware", available
from the Silicon Laboratories web site.
reset source inside the functions that write and erase Flash memory. The V
instructions should be placed just after the instruction to set PSWE to a '1', but before the
Flash write or erase operation instruction.
operators and explicitly DO NOT use the bit-wise operators (such as AND or OR). For exam-
ple, "RSTSRC = 0x02" is correct. "RSTSRC |= 0x02" is incorrect.
to check are initialization code which enables other reset sources, such as the Missing Clock
Detector or Comparator, for example, and instructions which force a Software Reset. A global
search on "RSTSRC" can quickly verify this.
should be exactly one routine in code that sets PSWE to a '1' to write Flash bytes and one rou-
tine in code that sets PSWE and PSEE both to a '1' to erase Flash pages.
updates and loop variable maintenance outside the "PSWE = 1; ... PSWE = 0;" area. Code
examples showing this can be found in AN201, "Writing to Flash from Firmware", available
from the Silicon Laboratories web site.
been reset to '0'. Any interrupts posted during the Flash write or erase operation will be ser-
viced in priority order after the Flash operation has been completed and interrupts have been
re-enabled by software.
Maintenance and the V
DD
, system clock frequency, or temperature. This accidental execution of Flash modi-
DD
monitor and enable the V
DD
DD
monitor and enabling the V
Monitor
DD
rise time specification of 1 ms is met. If the system cannot
Rev. 1.7
C8051F310/1/2/3/4/5/6/7
DD
DD
DD
monitor and enable the V
reaches 2.7 V and re-asserts RST if V
monitor as a reset source as early in code
DD
DD
brownout circuit to the RST pin of
monitor as a reset source. Code
DD
DD
monitor enable
monitor as a
115
DD

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