C8051F562-IQ Silicon Laboratories Inc, C8051F562-IQ Datasheet - Page 11

• Manufacturer Part Number: C8051F562-IQ
• Description: IC 8051 MCU 32K FLASH 32-QFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F56xr

Specifications of C8051F562-IQ

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 32-QFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: SMBus (2-Wire/I²C), LIN, SPI, UART/USART
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 25
• Ram Size: 2.25K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.25 V
• Data Converters: A/D 25x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: C8051F5x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 2304 B
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 25
• Operating Supply Voltage: 1.8 V to 5.25 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F560DK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1691 - KIT DEVELOPMENT FOR C8051F560
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1698

C8051F55x/56x/57x
List of Tables
Table 2.1. Product Selection Guide ......................................................................... 21
Table 3.1. Pin Definitions for the C8051F55x/56x/57x ............................................ 22
Table 4.1. QFN-40 Package Dimensions ................................................................ 28
Table 4.2. QFN-40 Landing Diagram Dimensions ................................................... 29
Table 4.3. QFP-32 Package Dimensions ................................................................ 30
Table 4.4. QFP-32 Landing Diagram Dimensions ................................................... 31
Table 4.5. QFN-32 Package Dimensions ................................................................ 32
Table 4.6. QFN-32 Landing Diagram Dimensions ................................................... 33
Table 4.7. QFN-24 Package Dimensions ................................................................ 34
Table 4.8. QFN-24 Landing Diagram Dimensions ................................................... 35
Table 5.1. Absolute Maximum Ratings .................................................................... 36
Table 5.2. Global Electrical Characteristics ............................................................. 37
Table 5.3. Port I/O DC Electrical Characteristics ..................................................... 40
Table 5.4. Reset Electrical Characteristics .............................................................. 41
Table 5.5. Flash Electrical Characteristics .............................................................. 41
Table 5.6. Internal High-Frequency Oscillator Electrical Characteristics ................. 42
Table 5.7. Clock Multiplier Electrical Specifications ................................................ 43
Table 5.8. Voltage Regulator Electrical Characteristics .......................................... 43
Table 5.9. ADC0 Electrical Characteristics .............................................................. 44
Table 5.10. Temperature Sensor Electrical Characteristics .................................... 45
Table 5.11. Voltage Reference Electrical Characteristics ....................................... 45
Table 5.12. Comparator 0 and Comparator 1 Electrical Characteristics ................. 46
Table 10.1. CIP-51 Instruction Set Summary .......................................................... 84
Table 12.1. Special Function Register (SFR) Memory Map for Pages 
0x00 and 0x0F .................................................................................... 106
Table 12.2. Special Function Register (SFR) Memory Map for Page 0x0C .......... 107
Table 12.3. Special Function Registers ................................................................. 108
Table 13.1. Interrupt Summary .............................................................................. 114
Table 14.1. Flash Security Summary .................................................................... 127
Table 17.1. EMIF Pinout (C8051F568-9 and ‘F570-5) .......................................... 144
Table 17.2. AC Parameters for External Memory Interface ................................... 154
Table 19.1. Port I/O Assignment for Analog Functions ......................................... 169
Table 19.2. Port I/O Assignment for Digital Functions ........................................... 169
Table 19.3. Port I/O Assignment for External Digital Event Capture Functions .... 170
Table 20.1. Baud Rate Calculation Variable Ranges ............................................ 192
Table 20.2. Manual Baud Rate Parameters Examples ......................................... 194
Table 20.3. Autobaud Parameters Examples ........................................................ 195
Table 20.4. LIN Registers* (Indirectly Addressable) .............................................. 200
Table 21.1. Background System Information ........................................................ 210
Table 21.2. Standard CAN Registers and Reset Values ....................................... 213
Table 22.1. SMBus Clock Source Selection .......................................................... 220
Table 22.2. Minimum SDA Setup and Hold Times ................................................ 221
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