MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 46

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

0x1816
0x1817
0x1818
0x1819–
0x181F
0x1820
0x1821
0x1822
0x1823
0x1824
0x1825
0x1826
0x1827–
0x183F
0x1840
0x1841
0x1842
0x1843
0x1844
0x1845
0x1846
0x1847
Chapter 4 Memory Map and Register Definition
Nonvolatile FLASH registers, shown in
include an 8-byte backdoor key that optionally can be used to gain access to secure memory resources.
During reset events, the contents of NVPROT and NVOPT in the nonvolatile register area of the FLASH
memory are transferred into corresponding FPROT and FOPT working registers in the high-page registers
to control security and block protection options.
44
Address
DBGC
DBGT
DBGS
Reserved
FCDIV
FOPT
Reserved
FCNFG
FPROT
FSTAT
FCMD
Reserved
PTAPE
PTASE
PTADS
Reserved
PTBPE
PTBSE
PTBDS
Reserved
Register Name
TRGSEL
PTBPE7
PTBSE7
PTBDS7
Table 4-3. High-Page Register Summary (continued)
DBGEN
KEYEN
FCBEF
DIVLD
Bit 7
AF
—
—
—
—
—
—
—
0
0
0
0
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
FNORED
PTBPE6
PTBSE6
PTBDS6
PRDIV8
BEGIN
FCCF
ARM
BF
—
—
—
—
—
—
—
6
0
0
0
0
Table
KEYACC
PTADS5
PTBDS5
PTAPE5
PTASE5
PTBPE5
PTBSE5
4-4, are located in the FLASH memory. These registers
FPVIOL
ARMF
TAG
—
—
—
—
—
—
—
5
0
0
FACCERR
PTAPE4
PTASE4
PTADS4
PTBPE4
PTBSE4
PTBDS4
BRKEN
FPS
—
—
—
—
—
—
—
4
0
0
0
0
FCMD
PTADS3
PTBDS3
PTAPE3
PTASE3
PTBPE3
PTBSE3
TRG3
CNT3
RWA
—
—
—
—
—
—
—
3
0
0
0
DIV
FBLANK
PTAPE2
PTASE2
PTADS2
PTBPE2
PTBSE2
PTBDS2
RWAEN
TRG2
CNT2
—
—
—
—
—
—
—
2
0
0
Freescale Semiconductor
PTAPE1
PTASE1
PTADS1
PTBPE1
PTBSE1
PTBDS1
SEC01
TRG1
CNT1
RWB
—
—
—
—
—
—
—
1
0
0
PTADS0
PTBDS0
PTAPE0
PTASE0
PTBPE0
PTBSE0
RWBEN
SEC00
FPDIS
TRG0
CNT0
Bit 0
—
—
—
—
—
—
—
0
0