STM32F101C8T6 STMicroelectronics, STM32F101C8T6 Datasheet - Page 82
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STM32F101C8T6
Manufacturer Part Number
STM32F101C8T6
Description
MCU ARM 64KB FLASH/TIMER 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F101C8T6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
37
Number Of Timers
3
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 12-bit
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
36MHz
Total Internal Ram Size
10KB
# I/os (max)
37
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6055
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Revision history
82/87
Table 54.
22-Nov-2007
Date
Document revision history (continued)
Revision
4
Document status promoted from preliminary data to datasheet. Small
text changes.
STM32F101CB part number corrected in
Number of communication peripherals corrected for STM32F101Tx in
Table 2: Device features and peripheral counts (STM32F101xx medium-
density access line)
Power supply schemes on page 16
Main function and default alternate function modified for PC14 and PC15
in
Remap column added.
Figure 11: Power supply scheme
and
in
Note 2
characteristics.
48 and 72 MHz frequencies removed from
Table
consumption on page
I
added in
and Standby
on page
Figure 17: Typical current consumption in Stop mode with regulator in
Low-power mode versus temperature at VDD = 3.3 V and 3.6 V
Note removed below
CPHA =
mode and CPHA =
Figure 34: Typical connection diagram using the ADC
t
respectively. Maximum values removed from
wakeup
endurance and data
characteristics.
Impedance size specified in
page
Section 5.3.11: Absolute maximum ratings (electrical sensitivity)
updated.
Details on unused pins removed from
characteristics on page
Table 41: SPI characteristics
Table 42: ADC
Note 3
conditions. Avg_Slope and V
Θ
characteristics.
Order codes replaced by
DD_VBAT
SU(HSE)
JA
Table 4: Medium-density STM32F101xx pin
Table 6: Current
value for VFQFPN36 package added in
Note 1
Doc ID 13586 Rev 14
71. Small text changes in
14. MCU ‘s operating conditions modified in
added in
and
timings. t
and t
42.
0. Note added below
typical value at 2.4 V modified and I
Table 15: Typical and maximum current consumptions in Stop
modified in
Note 2
Table 18: Peripheral current consumption
modes. Note added in
SU(LSE)
characteristics. Note added in
I2C interface characteristics on page 60
Table 10: Embedded reset and power control block
RET
characteristics.
added below
1(1).
and Number of GPIOs corrected for LQFP package.
retention. Conditions modified in
Figure 30: SPI timing diagram - slave mode and
conditions modified in
conditions modified in
41.
Table 5: Voltage
54.
Section 7: Ordering information
A.4: Voltage glitch on ADC input 0 on
25
updated. Notes added and I
Figure 31: SPI timing diagram - slave
Changes
modified in
Table 35: Output voltage
Table 44: ADC accuracy - limited test
modified. V
modified.
Table 16 on page 41
General input/output
STM32F101x8, STM32F101xB
characteristics.
Table 1: Device
Table
Table 46: TS
Table 52: Package thermal
Table 21
Table 28: Flash memory
DD
Table 25: Low-power mode
DD_VBAT
Table 43
definitions,
− V
12,
Typical current
SS
Table 13
and
Table 29: EMS
maximum value
modified.
modified.
ratings modified
and
Note 1
modified.
characteristics.
characteristics.
lkg
and
scheme.
Table
summary.
Note 6
Table
removed in
Table 17
and
modified
22,
added.
added,
46.