STM32F101C8T6 STMicroelectronics, STM32F101C8T6 Datasheet - Page 35
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STM32F101C8T6
Manufacturer Part Number
STM32F101C8T6
Description
MCU ARM 64KB FLASH/TIMER 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F101C8T6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
37
Number Of Timers
3
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 12-bit
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
36MHz
Total Internal Ram Size
10KB
# I/os (max)
37
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6055
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STM32F101x8, STM32F101xB
5.3.4
5.3.5
Embedded reference voltage
The parameters given in
temperature and V
Table 11.
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design, not tested in production.
Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in
measurement
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to Dhrystone 2.1 code.
Maximum current consumption
The MCU is placed under the following conditions:
●
●
●
●
●
The parameters given in
temperature and V
T
V
Symbol
V
S_vrefint
T
RERINT
REFINT
Coeff
All I/O pins are in input mode with a static value at V
All peripherals are disabled except if it is explicitly mentioned
The Flash access time is adjusted to f
wait state from 24 to 36 MHz)
Prefetch in on (reminder: this bit must be set before clock setting and bus prescaling)
When the peripherals are enabled f
(2)
(2)
(1)
Internal reference voltage
ADC sampling time when reading
the internal reference voltage
Internal reference voltage spread
over the temperature range
Temperature coefficient
Embedded internal reference voltage
scheme.
DD
DD
supply voltage conditions summarized in
Parameter
supply voltage conditions summarized in
Table 11
Table 12
Doc ID 13586 Rev 14
are derived from tests performed under the ambient
are derived from tests performed under the ambient
PCLK1
HCLK
–40 °C < T
V
DD
= f
Conditions
frequency (0 wait state from 0 to 24 MHz, 1
= 3 V ±10 mV
HCLK/2
A
Figure 12: Current consumption
< +85 °C 1.16
, f
DD
PCLK2
or V
Table
Table
= f
SS
Electrical characteristics
Min
HCLK
(no load)
8.
8.
1.20
Typ
5.1
17.1
Max
1.24
100
10
(2)
ppm/
Unit
35/87
mV
µs
°C
V