STM8S208RBT6 STMicroelectronics, STM8S208RBT6 Datasheet - Page 97
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STM8S208RBT6
Manufacturer Part Number
STM8S208RBT6
Description
MCU 8BIT 128K MEMORY 64-LQFP
Manufacturer
STMicroelectronics
Series
STM8Sr
Datasheet
1.STEVAL-MKI030V1.pdf
(105 pages)
Specifications of STM8S208RBT6
Mfg Application Notes
STM8S Getting Started
Core Processor
STM8
Core Size
8-Bit
Speed
24MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.95 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM8S20x
Core
STM8
Data Bus Width
8 bit
Data Ram Size
6 KB
Interface Type
CAN, 12C, SPI, UART
Maximum Clock Frequency
24 MHZ
Number Of Programmable I/os
52
Number Of Timers
2
Operating Supply Voltage
2.95 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWSTM8
Development Tools By Supplier
STICE-SYS001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
For Use With
497-10838 - DEMO BOARD STM8S208X497-10032 - EVAL KIT MOTOR CONTROL STM8S497-10031 - EVAL KIT TOUCH SENSING STM8S497-10592 - BOARD DAUGHTER FOR STM8S207/8497-10593 - KIT STARTER FOR STM8S207/8 SER497-8506 - BOARD EVAL FOR STM8S
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8957
STM8S208RBT6
STM8S208RBT6
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM8S208RBT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM8S208RBT6
Manufacturer:
ST
Quantity:
20 000
Part Number:
STM8S208RBT6B
Manufacturer:
ST
Quantity:
20 000
STM8S207xx, STM8S208xx
11.2
11.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 18: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
T
Where:
●
●
●
●
●
Table 57.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Jmax
environment.
Symbol
T
P
P
internal power.
P
P
V
Amax
= T
Dmax
INTmax
I/Omax
I/Omax
OH
JA
JA
JA
JA
JA
JA
JA
/I
is the package junction-to-ambient thermal resistance in C/W
Amax
OH
is the maximum ambient temperature in C
is the sum of P
= (V
represents the maximum power dissipation on output pins, where:
Thermal characteristics
is the product of I
of the I/Os at low and high level in the application.
+ (P
Thermal resistance junction-ambient
LQFP 80 - 14 x 14 mm
Thermal resistance junction-ambient
LQFP 64 - 14 x 14 mm
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 44 - 10 x 10 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
OL
Dmax
*I
OL
x
) + ((V
INTmax
JA
Doc ID 14733 Rev 11
)
DD
DD
and P
and V
Parameter
-V
OH)
(1)
I/Omax
DD
*I
, expressed in Watts. This is the maximum chip
OH
Jmax
Jmax
), and taking account of the actual V
(P
) must never exceed the values given in
, in degrees Celsius, may be calculated
57.
Dmax
= P
INTmax
+ P
Package characteristics
I/Omax
Value
38
45
46
57
54
60
)
OL
/I
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
OL
Unit
97/105
and