ST7FLITE29F2M6 STMicroelectronics, ST7FLITE29F2M6 Datasheet - Page 121
ST7FLITE29F2M6
Manufacturer Part Number
ST7FLITE29F2M6
Description
IC MCU 8BIT 8K FLASH 20SOIC
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST7FLITE20F2B6.pdf
(133 pages)
Specifications of ST7FLITE29F2M6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
15
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
ST7FLITE2x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
15
Number Of Timers
4 bit
Operating Supply Voltage
2.4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7FLIT2-COS/COM, ST7FLITE-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
13 bit
For Use With
497-5858 - EVAL BOARD PLAYBACK ST7FLITE497-5049 - KIT STARTER RAISONANCE ST7FLITE497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-2135-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST7FLITE29F2M6TR
Manufacturer:
ST
Quantity:
5 700
Part Number:
ST7FLITE29F2M6TR
Manufacturer:
ST
Quantity:
20 000
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
■
■
Table 22. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
SDIP & PDIP
TQFP and SO
ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
.
TM
TM
aspects
(AN2033,
packages are qualified according
transition program is available on
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP, SDIP and SO Pb-packages are compati-
are fully compatible with Lead (Pb) containing
soldering process (see application note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
TM
TQFP, SDIP and SO packages
Pb-free solder paste
Yes *
Yes *
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