STM32F100V8T6B STMicroelectronics, STM32F100V8T6B Datasheet
STM32F100V8T6B
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STM32F100V8T6B
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STM32F100V8T6B Summary of contents
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Low & medium-density value line, advanced ARM-based 32-bit MCU with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces Features ■ Core: ARM 32-bit Cortex™-M3 CPU – 24 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance ...
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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2.22 Remap capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Contents 5.3.16 5.3.17 5.3.18 6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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List of tables Table 45. DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB List of figures Figure 1. STM32F100xx value line block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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List of figures Figure 43. LQFP48 – mm, 48-pin low-profile quad flat package outline ...
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... STM32F100xx Flash programming manual. The reference and Flash programming manuals are both available from the STMicroelectronics website www.st.com. For information on the Cortex™-M3 core please refer to the Cortex™-M3 Technical Reference Manual, available from the www.arm.com website at the following address: http://infocenter ...
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Description 2 Description The STM32F100xx value line family incorporates the high-performance ARM Cortex™-M3 32-bit RISC core operating MHz frequency, high-speed embedded memories (Flash memory up to 128 Kbytes and SRAM Kbytes), and an extensive ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2.1 Device overview The description below gives an overview of the complete range of peripherals proposed in this family. Figure 1 shows the general block diagram of the device family. Table 2. STM32F100xx features and peripheral ...
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Description Figure 1. STM32F100xx value line block diagram 1. Peripherals not present in low-density value line devices alternate function on I/O port pin –40 °C to +85 °C (junction temperature up to 105 °C) ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 2. Clock tree 4. To have an ADC conversion time of 1.2 µs, APB2 must MHz. Doc ID 16455 Rev 5 Description 13/86 ...
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Description 2.2 Overview ® 2.2.1 ARM Cortex™-M3 core with embedded Flash and SRAM The ARM Cortex™-M3 processor is the latest generation of ARM processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2.6 Nested vectored interrupt controller (NVIC) The STM32F100xx value line embeds a nested vectored interrupt controller able to handle maskable interrupt channels (not including the 16 interrupt lines of Cortex™-M3) and 16 priority ...
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Description 2.10 Power supply schemes ● 2.0 to 3.6 V: External power supply for I/Os and the internal regulator. DD Provided externally through V ● SSA DDA and PLL (minimum voltage to be applied to ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB The device can be woken up from Stop mode by any of the EXTI line. The EXTI line source can be one of the 16 external lines, the PVD output or the RTC alarm. ● Standby ...
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Description Table 3. Timer feature comparison Counter Timer resolution TIM1 16-bit TIM2, TIM3, 16-bit TIM4 TIM15 16-bit TIM16, 16-bit TIM17 TIM6, 16-bit TIM7 2.16.1 Advanced-control timer (TIM1) The advanced-control timer (TIM1) can be seen as a three-phase PWM multiplexed on ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB pulse mode output. This gives input captures/output compares/PWMs on the largest packages. The TIM2, TIM3, TIM4 general-purpose timers can work together or with the TIM1 advanced-control timer via the Timer Link feature for ...
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Description 2.16.6 SysTick timer This timer is dedicated for OS, but could also be used as a standard down counter. It features: ● A 24-bit down counter ● Autoreload capability ● Maskable system interrupt generation when the counter reaches 0. ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2.21 GPIOs (general-purpose inputs/outputs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as input (with or without pull-up or pull-down peripheral alternate function. Most of the GPIO ...
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Description Eight DAC trigger inputs are used in the STM32F100xx. The DAC channels are triggered through the timer update outputs that are also connected to different DMA channels. 2.25 Temperature sensor The temperature sensor has to generate a voltage that ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 3 Pinouts and pin description Figure 3. STM32F100xx value line LQFP100 pinout VBAT PC13-TAMPER-RTC PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 OSC_IN OSC_OUT NRST VSSA VREF- VREF+ VDDA PA0-WKUP PE2 1 PE3 2 PE4 3 PE5 4 PE6 5 ...
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Pinouts and pin description Figure 4. STM32F100xx value line LQFP64 pinout PC13-TAMPER-RTC PC15-OSC32_OUT Figure 5. STM32F100xx value line LQFP48 pinout PC13-TAMPER-RTC PC15-OSC32_OUT 24/86 STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 6. STM32F100xx value line TFBGA64 ballout 1 PC14- A OSC32_IN PC15- B OSC32_OUT C OSC_IN D OSC_OUT E NRST V SSA F V REF DDA Table 4. STM32F100xx pin definitions Pins Pin ...
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Pinouts and pin description Table 4. STM32F100xx pin definitions (continued) Pins Pin name PC14 OSC32_IN PC15 OSC32_OUT SS_5 DD_5 ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 4. STM32F100xx pin definitions (continued) Pins Pin name PC5 PB0 PB1 PB2 PE7 39 - ...
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Pinouts and pin description Table 4. STM32F100xx pin definitions (continued) Pins Pin name PD15 PC6 PC7 PC8 PC9 ...
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... STM32F10xxx reference manual. 12. This alternate function can be remapped by software to some other port pins (if available on the used package). For more details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, available from the STMicroelectronics website: www.st.com. Main (3) ...
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Memory mapping 4 Memory mapping The memory map is shown in Figure 7. Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex-M3 internal peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 Peripherals 0x4000 ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient ...
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Electrical characteristics Figure 8. Pin loading conditions 5.1.6 Power supply scheme Figure 10. Power supply scheme 1.8-3.6V 5 × 100 × 4.7 µ µF + ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.1.7 Current consumption measurement Figure 11. Current consumption measurement scheme 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 6: Current characteristics, and damage to the device. These are stress ratings only ...
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Electrical characteristics Table 6. Current characteristics Symbol I Total current into V VDD I Total current out of V VSS Output current sunk by any I/O and control pin I IO Output current source by any I/Os and control pin ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 8. General operating conditions (continued) Symbol V Backup operating voltage BAT Power dissipation °C for suffix 105 °C for suffix 7 Ambient temperature for 6 suffix version ...
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Electrical characteristics . Table 10. Embedded reset and power control block characteristics Symbol Programmable voltage V PVD detector level selection (2) V PVD hysteresis PVDhyst Power on/power down V POR/PDR reset threshold (2) V PDR hysteresis PDRhyst (2) t Reset ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.4 Embedded reference voltage The parameters given in temperature and V Table 11. Embedded internal reference voltage Symbol V Internal reference voltage REFINT ADC sampling time when (1) T reading the internal S_vrefint reference voltage Internal ...
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Electrical characteristics Table 12. Maximum current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply I current in DD Run mode 1. Based on characterization, not tested in production. 2. External clock is 8 MHz ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 12. Maximum current consumption in Run mode versus frequency (at 3 code with data processing running from RAM, peripherals enabled Figure 13. Maximum current consumption in Run mode versus frequency (at 3.6 V) ...
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Electrical characteristics Table 15. Typical and maximum current consumptions in Stop and Standby modes Symbol Parameter Regulator in Run mode, Low-speed and high-speed internal RC oscillators and high- speed oscillator OFF (no independent watchdog) Supply current in Stop mode Regulator ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 15. Typical current consumption in Stop mode with regulator in Run mode versus temperature at V Figure 16. Typical current consumption in Stop mode with regulator in Low-power mode versus temperature 3.3 ...
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Electrical characteristics Figure 17. Typical current consumption in Standby mode versus temperature at V 3.6 V Typical current consumption The MCU is placed under the following conditions: ● All I/O pins are in input mode with a static value at ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 16. Typical current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply I current in DD Run mode 1. Typical values are measures Add an additional power ...
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Electrical characteristics Table 17. Typical current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply current Sleep mode 1. Typical values are measures Add an additional power consumption of 0.8 ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 18. Peripheral current consumption Peripheral TIM2 TIM3 TIM4 TIM6 TIM7 DAC APB1 WWDG SPI2 USART2 USART3 I2C1 I2C2 HDMI CEC GPIO A GPIO B GPIO C GPIO D GPIO E ADC1 APB2 SPI1 USART1 TIM1 ...
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Electrical characteristics Table 19. High-speed external user clock characteristics Symbol User external clock source f HSE_ext frequency OSC_IN input pin high level V HSEH voltage OSC_IN input pin low level V HSEL voltage t w(HSE) OSC_IN high or low time ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 18. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) External clock source Figure 19. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t ...
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Electrical characteristics Table 21. HSE 4-24 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance C L1 versus equivalent serial ( resistance of the crystal (R i HSE driving current 2 g ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Note: For C and recommended to use high-quality ceramic capacitors in the range selected to match the requirements of the crystal or resonator. C usually the ...
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Electrical characteristics 5.3.7 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 23. HSI oscillator characteristics Symbol f Frequency HSI ACC Accuracy of HSI oscillator HSI t HSI oscillator startup time su(HSI) ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 25. Low-power mode wakeup timings Symbol (1) t WUSLEEP (1) t WUSTOP (1) t WUSTDBY 1. The wakeup times are measured from the wakeup event to the point at which the user application code reads ...
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Electrical characteristics 5.3.9 Memory characteristics Flash memory The characteristics are given at T Table 27. Flash memory characteristics Symbol t 16-bit programming time prog t Page (1 KB) erase time ERASE t Mass erase time ME I Supply current DD ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (Electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is ...
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Electrical characteristics Electromagnetic Interference (EMI) The electromagnetic field emitted by the device is monitored while a simple application is executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with IEC 61967-2 standard which specifies the test ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.12 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 33. I/O static characteristics Symbol Parameter Standard I/O input low level voltage V IL ...
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Electrical characteristics Figure 22. Standard I/O input characteristics - CMOS port Figure 23. Standard I/O input characteristics - TTL port 56/86 STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Doc ID 16455 Rev 5 ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 24 tolerant I/O input characteristics - CMOS port Figure 25 tolerant I/O input characteristics - TTL port Output driving current The GPIOs (general-purpose inputs/outputs) can sink or source up to ±8 ...
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Electrical characteristics Output voltage levels Unless otherwise specified, the parameters given in performed under the ambient temperature and V in Table 8. All I/Os are CMOS and TTL compliant. Table 34. Output voltage characteristics Symbol Output Low level voltage for ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 35, respectively. Unless otherwise specified, the parameters given in performed under the ambient temperature and V in Table 8. Table 35. ...
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Electrical characteristics Figure 26. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved 2/3)T and if the duty cycle is (45-55%) 5.3.13 NRST pin characteristics The NRST pin input ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.14 TIMx characteristics The parameters given in Refer to Section 5.3.12: I/O port characteristics function characteristics (output compare, input capture, external clock, PWM output). Table 37. TIMx characteristics Symbol t Timer resolution time res(TIM) Timer external ...
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Electrical characteristics 2 Table 38 characteristics Symbol t SCL clock low time w(SCLL) t SCL clock high time w(SCLH) t SDA setup time su(SDA) t SDA data hold time h(SDA) t r(SDA) SDA and SCL rise time t ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2 Figure 28 bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V Table 39. SCL frequency ( External pull-up resistance For speeds ...
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Electrical characteristics SPI interface characteristics Unless otherwise specified, the parameters given in performed under the ambient temperature, f conditions summarized in Refer to Section 5.3.12: I/O port characteristics function characteristics (NSS, SCK, MOSI, MISO). Table 40. SPI characteristics Symbol f ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 29. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I ...
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Electrical characteristics Figure 31. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: 0.3V HDMI ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 41. ADC characteristics Symbol Parameter V Power supply DDA V Positive reference voltage REF+ Current on the V input REF I VREF pin f ADC clock frequency ADC (2) Sampling rate f S (2) f ...
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Electrical characteristics The above formula error below 1/4 of LSB. Here (from 12-bit resolution). Table 42. R AIN T (cycles) s 1.5 7.5 13.5 28.5 41.5 55.5 71.5 239.5 1. Guaranteed by design, not tested in production. ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB add a Schottky diode (pin to ground) to standard analog pins which may potentially inject negative currents. Any positive injection current within the limits specified for I Section 5.3.12 does not affect the ADC accuracy. Figure ...
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Electrical characteristics Figure 34. Power supply and reference decoupling (V 1 µ available on 100-pin packages and on TFBGA64 packages. V REF+ packages only. Figure 35. Power supply and reference decoupling ( ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.17 DAC electrical specifications Table 45. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Ground SSA (2) R Resistive load with buffer ON LOAD (1) R Impedance output with ...
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Electrical characteristics Table 45. DAC characteristics (continued) Symbol Parameter Offset error (difference between measured value (3) Offset at Code (0x800) and the ideal value = V /2) REF+ Gain Gain error (3) error Settling time (full scale: for a 10-bit ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.18 Temperature sensor characteristics Table 46. TS characteristics Symbol ( linearity with temperature L SENSE (1) Avg_Slope Average slope (1) V Voltage at 25°C 25 (2) t Startup time START (3)(2) T ADC sampling ...
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Package characteristics 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 37. LQFP100 mm, 100-pin low-profile quad flat package outline 100 26 Pin identification e 1. Drawing is not to scale. 2. Dimensions ...
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Package characteristics Figure 39. LQFP64 – mm, 64 pin low-profile quad flat package outline Pin 1 identification Drawing is not to scale. 2. Dimensions are ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 41. TFBGA64 - active ball array mm, 0.5 mm pitch, package outline Seating plane 1. Drawing is not to scale. Table 49. TFBGA64 - active ball ...
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Package characteristics Figure 42. Recommended PCB design rules for pads (0.5 mm pitch BGA) Dpad Dsm 1. Non solder mask defined (NSMD) pads are recommended mils solder paste screen printing process 78/86 STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 43. LQFP48 – mm, 48-pin low-profile quad flat package outline Seating plane ccc Pin 1 1 identification 1. Drawing is ...
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Package characteristics 6.2 Thermal characteristics The maximum chip junction temperature (T Table 8: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in C, ● ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 6.2.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation ...
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Package characteristics Using the values obtained in – For LQFP100, 46 °C 115 °C + (46 °C/W × 134 mW) = 115 °C + 6.2 °C = 121.2 °C Jmax This is within the range of the suffix ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 7 Ordering information scheme Table 52. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = General-purpose Device subfamily 100 = value line Pin count pins R = ...
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Revision history 8 Revision history Table 53. Document revision history Date Revision 12-Oct-2009 26-Feb-2010 84/86 STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 1 Initial release. TFBGA64 package added (see Note 5 modified in Table 4: STM32F100xx pin I modified in Table 6: Current ...
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 53. Document revision history (continued) Date Revision 30-Mar-2010 06-May-2010 12-Jul-2010 Revision history corrected. Updated Table 6: Current characteristics Values and note updated in Run mode, code with data processing running from Flash Table 17: Typical ...
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