STM32F100R6T6B STMicroelectronics, STM32F100R6T6B Datasheet - Page 86
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STM32F100R6T6B
Manufacturer Part Number
STM32F100R6T6B
Description
MCU 32BIT ARM 32K FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F100R4T6B.pdf
(87 pages)
Specifications of STM32F100R6T6B
Featured Product
STM32 Value Line
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
4 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
51
Number Of Timers
5
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ST-LINK, STM32100B-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10496
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100R6T6B
Manufacturer:
STMicroelectronics
Quantity:
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Company:
Part Number:
STM32F100R6T6B
Manufacturer:
STMicroelectronics
Quantity:
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Part Number:
STM32F100R6T6B
Manufacturer:
ST
Quantity:
20 000
Revision history
86/87
Table 54.
06-May-2010
30-Mar-2010
04-Apr-2011
12-Jul-2010
Date
Document revision history (continued)
Revision
3
4
5
6
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Revision history corrected.
Updated
Values and note updated in
Run mode, code with data processing running from Flash
Table 17: Typical current consumption in Sleep mode, code running
from Flash or
Updated
and Standby modes
Added
vs. temperature at different VBAT values
Typical consumption for ADC1 corrected in
current
Maximum current consumption
frequency conditions corrected.
Updated
f
Small text changes.
Updated
Table 32: Electrical sensitivities on page 54
Updated
and
Updated
Updated
and
Updated
Updated footnotes below
and
Updated tw min in
characteristics on page 45
Updated startup time in
= 32.768 kHz) on page 48
Updated
Added
Updated
Corrected TTL and CMOS designations in
characteristics on page 59
Removed note on remapped characteristics from
characteristics on page 65
ADC
Doc ID 16455 Rev 6
Table 45: ADC accuracy on page 69
Table 45: ADC accuracy on page 69
Table 6: Current characteristics on page 33
max corrected in
Figure 14: Typical current consumption on VBAT with RTC on
Section 5.3.12: I/O current injection characteristics on page 55
consumption.
Table 15: Typical and maximum current consumptions in Stop
Table 6: Current characteristics
Table 30: EMI characteristics
Table 31: ESD absolute maximum ratings on page 54
Table 44: ADC accuracy - limited test conditions on page 69
Table 24: LSI oscillator characteristics on page 50
Table 44: ADC accuracy - limited test conditions on page 69
Figure 2: Clock tree
Table 23: HSI oscillator characteristics on page 49
Table 34: I/O static characteristics on page 56
RAM.
Table 19: High-speed external user clock
Table 42: ADC
Table 22: LSE oscillator characteristics (fLSE
Table 5: Voltage characteristics on page 32
Table 16: Typical current consumption in
to add FLITF clock
Changes
and
Output driving current
Typical current
characteristics.
Table 35: Output voltage
Table 18: Peripheral
Table 41: SPI
consumption:
corrected.
and
and