LPC1766FBD100,551 NXP Semiconductors, LPC1766FBD100,551 Datasheet - Page 68
![IC ARM CORTEX MCU 256K 100-LQFP](/photos/6/65/66516/568-100-lqfp_sot407-1_sml.jpg)
LPC1766FBD100,551
Manufacturer Part Number
LPC1766FBD100,551
Description
IC ARM CORTEX MCU 256K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets
1.OM11043.pdf
(79 pages)
2.LPC1765FBD100551.pdf
(74 pages)
3.LPC1766FBD100551.pdf
(66 pages)
Specifications of LPC1766FBD100,551
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
70
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Cpu Family
LPC17xx
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
64KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Package
100LQFP
Family Name
LPC1700
Maximum Speed
100 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4795
935287917551
935287917551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1766FBD100,551
Manufacturer:
NXP
Quantity:
5 600
Company:
Part Number:
LPC1766FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1766FBD100,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
15. Package outline
Fig 36. Package outline (LQFP80)
LPC1759_58_56_54_52_51
Product data sheet
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT315-1
max.
1.6
A
61
80
y
60
1
0.16
0.04
A
1
e
A
1.5
1.3
2
pin 1 index
136E15
IEC
0.25
A
b
3
p
H
D
D
0.27
0.13
b
p
w
M
0.18
0.12
c
All information provided in this document is subject to legal disclaimers.
X
MS-026
JEDEC
12.1
11.9
D
Z D
41
20
(1)
0
REFERENCES
40
21
Rev. 6.01 — 11 March 2011
12.1
11.9
E
(1)
Z E
b
B
w
e
p
0.5
e
v
M
v
M
JEITA
scale
14.15
13.85
M
H
B
5
D
A
E
A
14.15
13.85
H
H
E
LPC1759/58/56/54/52/51
E
L
1
10 mm
A
0.75
0.30
L
A
p
32-bit ARM Cortex-M3 microcontroller
2
A
1
0.2
v
0.15
w
PROJECTION
EUROPEAN
detail X
0.1
y
Z
1.45
1.05
D
(1)
L
Z
© NXP B.V. 2011. All rights reserved.
L
1.45
1.05
E
p
ISSUE DATE
(1)
00-01-19
03-02-25
(A )
7
0
θ
3
o
o
SOT315-1
θ
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