LPC3240FET296/01,5 NXP Semiconductors, LPC3240FET296/01,5 Datasheet
LPC3240FET296/01,5
Specifications of LPC3240FET296/01,5
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LPC3240FET296/01,5 Summary of contents
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ES_LPC3240 Errata sheet LPC3240 Rev. 8 — 1 February 2011 Document information Info Content Keywords LPC3240 errata Abstract This errata sheet describes both the known functional problems and any deviations from the electrical specifications known at the release date of ...
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... Added clarification regarding /01 Revision ‘A’ parts. • 5 20100205 The format of this errata sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Added DDR write set-up time. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 1. Product identification The LPC3240 devices typically have the following top-side marking: LPC3240FET296 xxxxxxx xxYYWWR The last letter in the last line (field ‘R’) will identify the device revision. This Errata Sheet covers the following revisions of the LPC3240: Table 1. Revision identifier (R) [1] ‘ ...
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... NXP Semiconductors Table 3. AC/DC deviations table AC/DC Short description deviations ESD.1 Weak ESD protection on Reset_N pin (pin M14) ES_LPC3240 Errata sheet Revision identifier ‘-’ All information provided in this document is subject to legal disclaimers. Rev. 8 — 1 February 2011 ES_LPC3240 Errata sheet LPC3240 Detailed description Section 4 ...
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... NXP Semiconductors 3. Functional problems detail 3.1 DMA.1: Single burst DMA memory-to-memory transfers have additional memory cycles when the DMA source memory is on the EMC bus Introduction: The DMA controller is an AHB master that can transfer blocks of data between peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory ...
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... NXP Semiconductors DMA register values used in DMACConfig = 0x01 DMACCxSrcAddr = 0xe0000000; EMC_CS0 DMACCxDestAddr = 0xe0000040; EMC_CS0 DMACCxLLI = 0x0 DMACCxControl = 0x0c480004; Dest & Src addrs increment, Dest & Src 32-bit; Dburst & Sburst size 1; transfer size 4 DMACCxConfig = 0x01 EMCStaticConfig0 = 0x00000082; 32-bit width, Byte lane state 1 Fig 2 ...
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... NXP Semiconductors Work-around: When interfacing an external peripheral device that does not support burst mode access through the EMC Static Memory interface the following work-arounds are recommended: 1. Avoid using DMA to transfer read blocks of data from the external device. Instead use a software loop with LDR instruction to read blocks of data from the external device. ...
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... NXP Semiconductors Fig 3. 128 MB DDR SDRAM example 3.3 Ethernet.1: Ethernet TxConsumeIndex register does not update correctly after the first frame is sent Introduction: The transmit consume index register defines the descriptor that is going to be transmitted next by the hardware transmit process. After a frame has been transmitted hardware increments the index, wrapping the value to 0 once the value of TxDescriptorNumber has been reached ...
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... NXP Semiconductors EMC_CLK command WRITE EMC_DQS[1:0] EMC_D[15:0], EMC_DQM[1:0] Fig 4. Basic DDR write timing Problem: For DDR writes the LPC3240 drives the EMC_DQS[1:0] earlier in the data valid window than center aligned. With the EMC_CLK at 133 MHz this produces a minimum set-up time between the EMC_D[15:0] and EMC_DQS[1:0] of 600 ps across silicon process, voltage and temperature. Test conditions are with the EMC buffers set to fast slew rate driving 2 inches of 50 Ω ...
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... NXP Semiconductors 5. The PCB trace length of EMC_DQS[1:0] should be at least 2 inches (but not more than 4 inches) longer than EMC_DQ[15:0] and EMC_DQM[1:0 typical FR4 PCB this adds at least 334 ps to set-up time margin for DDR writes. For reads from DDR the increased trace length of EMC_DQS[1:0] will be automatically compensated for by the software initialization function find_ddr_dqsin_delay() which sets the optimal value DDR_DQSIN_DELAY(SDRAMCLK_CTRL[6:2]) ...
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... NXP Semiconductors 3.5 DDR.1: DDR interface has >1.2 ns clock skew Introduction: DDR memory uses a differential clock which is generated by the LPC3240. The differential clock consists of two clock signals: EMC_CLK is the positive clock and DDR_nCLK is the negative clock. Problem: There is approximately 1. skew between the low transition of the DDR_nCLK and the high transition of the EMC_CLK ...
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... NXP Semiconductors 3.6 RTC.1: An RTC match doesn’t drive the ONSW pin active (HIGH) Introduction: An ONSW output pin (M15) is included in the LPC3240 to assist in waking up the chip after power is removed from all functions except the RTC and Battery RAM. When there is an active match condition the RTC will drive the ONSW pin HIGH. The RTC only drives ...
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... NXP Semiconductors 3.8 MCPWM.1: Input pins (MCI0-2) on the Motor Control PWM peripheral are not functional Introduction: On the LPC3240, the Motor Control PWM (MCPWM) peripheral is optimized for three-phase AC and DC motor control applications and can also be used in applications which require timing, counting, capture, and comparison. The MCPWM contains three input pins (MCI0-2) for PWM channels 0, 1, and 2 ...
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... NXP Semiconductors 3.9 HSUART.1: High speed UART receive FIFO and status can freeze Introduction: The three high speed UART's (HSUART) receive (RX) FIFOs can sometimes enter a state where they no longer accept received data. When this state occurs, the HSUART's RX FIFO will no longer accept data regardless of RX FIFO fill status. The receive state of the HSUART may indicate a number of possible, but invalid, receive statuses ...
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... NXP Semiconductors 4. AC/DC deviations detail 4.1 ESD.1: Weak ESD protection on Reset_N pad Introduction: The LPC3240 was designed to withstand electrostatic discharges up to 2000 V using the Human Body Model. Problem: The RESET_N pad (pin M14) does not pass ESD tests above 1000 V. Work-around: ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors 6. Contents 1 Product identification . . . . . . . . . . . . . . . . . . . . 3 2 Errata overview . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Functional problems detail . . . . . . . . . . . . . . . . 5 3.1 DMA.1: Single burst DMA memory-to-memory transfers have additional memory cycles when the DMA source memory is on the EMC bus . . . . . 5 Introduction Problem Work-around 3.2 NOR.1: When booting from NOR flash, SDRAM devices will not release the data bus, preventing the LPC3240 from booting correctly ...