LPC3220FET296/01,5 NXP Semiconductors, LPC3220FET296/01,5 Datasheet - Page 42
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LPC3220FET296/01,5
Manufacturer Part Number
LPC3220FET296/01,5
Description
IC ARM9 MCU 128K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Specifications of LPC3220FET296/01,5
Package / Case
296-TFBGA
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
128 KB
Interface Type
EMC
Maximum Clock Frequency
266 MHz
Number Of Timers
6
Operating Supply Voltage
1.31 V to 1.39 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4965
935290763551
935290763551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC3220FET296/01,5
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Limiting values
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
LPC3220_30_40_50_1
Preliminary data sheet
Symbol
V
V
V
V
V
V
I
I
T
P
V
DD
SS
stg
DD(1V2)
DD(EMC)
DDA(3V3)
DD(IO)
IA
I
tot(pack)
esd
The following applies to
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Core, PLL, oscillator, and RTC supplies; applies to pins VDD_CORE, VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK,
VDD_PLLUSB, VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC.
I/O pad supply; applies to domains VDD_EMC and VDD_IOC.
Applies to VDD_AD pins.
Applies to pins in the following domains VDD_IOA, VDD_IOB, and VDD_IOD.
Including voltage on outputs in 3-state mode.
Based on package heat transfer, not device power consumption. Calculated package thermal resistance (Theta
JEDEC Test Board and 0 m/s airflow,
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Charge device model per AEC-Q100-011.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
otherwise noted.
Parameter
supply voltage (1.2 V)
external memory controller
supply voltage
analog supply voltage (3.3 V)
input/output supply voltage
analog input voltage
input voltage
supply current
ground current
storage temperature
total power dissipation
(per package)
electrostatic discharge voltage
Limiting values
Table
6:
15 % accuracy).
Conditions
1.8 V pins
3.3 V pins
per supply pin
per ground pin
max. junction temp 125 C
max. ambient temp 85 C
HBM
CDM
Rev. 01 — 6 February 2009
[1]
LPC3220/30/40/50
Notes Min
16/32-bit ARM microcontrollers
[2]
[3]
[4]
[5]
[6]
[6]
[7]
[8]
[9]
-
-
0.5
0.5
0.5
0.5
0.5
0.5
0.5
65
Max
+1.4
+4.6
+4.6
+4.6
+4.6
+2.4
+4.6
100
100
+150
1.12
+2000
+500
JA
© NXP B.V. 2009. All rights reserved.
): 35.766 C/W (with
SS
unless
Unit
V
V
V
V
V
V
V
mA
mA
W
V
V
C
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