LPC1342FHN33,551 NXP Semiconductors, LPC1342FHN33,551 Datasheet - Page 3

• Manufacturer Part Number: LPC1342FHN33,551
• Description: IC MCU 32BIT 16KB FLASH 33HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1342FHN33,551

• Program Memory Type: FLASH
• Program Memory Size: 16KB (16K x 8)
• Package / Case: 33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 4 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 28
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Package: 33HVQFN EP
• Device Core: ARM Cortex M3
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4946; 935289656551

NXP Semiconductors
4. Ordering information
Table 1.
Table 2.
LPC1311_13_42_43
Product data sheet
Type number
LPC1311FHN33 HVQFN33
LPC1313FBD48 LQFP48
LPC1313FHN33 HVQFN33
LPC1342FHN33 HVQFN33
LPC1343FBD48 LQFP48
LPC1343FHN33 HVQFN33
Type number
LPC1311FHN33
LPC1313FBD48
LPC1313FHN33
LPC1342FHN33
LPC1343FBD48
LPC1343FHN33
Ordering information
Ordering options for LPC1311/13/42/43
4.1 Ordering options
Package
Name
Flash
8 kB
32 kB
32 kB
16 kB
32 kB
32 kB
Description
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
Total
SRAM
4 kB
8 kB
8 kB
4 kB
8 kB
8 kB
All information provided in this document is subject to legal disclaimers.
USB
-
-
-
Device
Device
Device
Rev. 3 — 10 August 2010
UART
RS-485
1
1
1
1
1
1
I
Fast+
1
1
1
1
1
1
2
C/
32-bit ARM Cortex-M3 microcontroller
SSP
1
1
1
1
1
1
LPC1311/13/42/43
ADC
channels
8
8
8
8
8
8
Pins
33
48
33
33
48
33
© NXP B.V. 2010. All rights reserved.
Package
HVQFN33
LQFP48
HVQFN33
HVQFN33
LQFP48
HVQFN33
Version
n/a
n/a
n/a
n/a
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