LPC2101FBD48,151 NXP Semiconductors, LPC2101FBD48,151 Datasheet - Page 27

• Manufacturer Part Number: LPC2101FBD48,151
• Description: IC ARM7 MCU FLASH 8K 48-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2101FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 70MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 2 KB
• Interface Type: I2C/JTAG/SPI/SSP/UART
• Maximum Clock Frequency: 70 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Package: 48LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 70 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100MCB2103UME - BOARD EVAL MCB2103 + ULINK-MEMCB2103U - BOARD EVAL MCB2103 + ULINK2MCB2103 - BOARD EVAL NXP LPC2101/2101/2103622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-2092; 935280963151; LPC2101FBD48-S

NXP Semiconductors
LPC2101_02_03_4
Product data sheet
8.1 Power consumption in Deep power-down mode
Fig 6.
Fig 7.
I
DD(CORE)
( A
( A
I
BAT
1.25
0.75
12.5
1.5
0.5
7.5
Test conditions: Deep power-down mode entered; RTC off; SRAM off;
V
Core supply current I
voltages
15
10
Test conditions: Deep power-down mode entered; V
V
Battery supply current I
1
5
i(VBAT)
DD(3V3)
40
40
= V
= V
DD(3V3)
DDA
= 3.3 V.
Rev. 04 — 2 June 2009
= V
15
15
DDA
DD(CORE)
= 3.3 V.
BAT
measured at different temperatures and conditions
10
10
measured at different temperatures and supply
Single-chip 16-bit/32-bit microcontrollers
V
RTC on; SRAM on
RTC on; SRAM off
DD(1V8)
35
35
i(BAT)
=1.8 V
= 3.3 V; V
1.7 V
LPC2101/02/03
RTC off; SRAM on
RTC off; SRAM off
DD(1V8)
60
60
Temperature ( C)
Temperature ( C)
1.65 V
= 1.8 V;
002aae680
002aae681
© NXP B.V. 2009. All rights reserved.
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