DSPIC30F6010-20I/PF Microchip Technology, DSPIC30F6010-20I/PF Datasheet - Page 170
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC30F6010-20I/PF
Manufacturer Part Number
DSPIC30F6010-20I/PF
Description
IC PSPIC MCU/DSP 144K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F6010A-30IPF.pdf
(22 pages)
2.DSPIC30F6010-20IPF.pdf
(222 pages)
3.DSPIC30F6010-20IPF.pdf
(30 pages)
Specifications of DSPIC30F6010-20I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F601020IPF
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6010-20I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010-20I/PF
Manufacturer:
MICROCHI
Quantity:
20 000
- DSPIC30F6010A-30IPF PDF datasheet
- DSPIC30F6010-20IPF PDF datasheet #2
- DSPIC30F6010-20IPF PDF datasheet #3
- Current page: 170 of 222
- Download datasheet (4Mb)
dsPIC30F6010
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70119E-page 168
dsPIC30F6010-30I
dsPIC30F6010-20I
dsPIC30F6010-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
3:
P
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
I
/
INT
V
V
V
V
S
O
Symbol
Junction to ambient thermal resistance, Theta-ja (
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
=
DD
DD
DR
POR
VDD
=
∑
V
THERMAL OPERATING CONDITIONS
D D
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
(2)
V
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
D D
DD
DD
I
D D
–
Start Voltage
Rise Rate
V
Characteristic
–
O H
∑
Rating
Characteristic
I
O H
I
OH
DD
+
∑
can be lowered without losing RAM data.
V
O L
I
(3)
O L
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
0.05
Min
2.5
2.5
—
—
JA
) numbers are achieved by package simulations.
Typ
V
1.5
—
—
SS
Symbol
Symbol
P
(1)
DMAX
P
T
T
T
T
T
T
JA
JA
A
A
A
D
J
J
J
Max
5.5
5.5
—
—
Min
Typ
-40
-40
-40
-40
-40
-40
50
50
-40°C T
-40°C
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
© 2006 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3V in 60 ms
- T
T
Max
Typ
A
A
+ P
A
)/
+85°C for Industrial
+125°C for Extended
I
/
O
JA
Conditions
°C/W
°C/W
+125
+150
+150
+125
Max
Unit
+85
+85
Notes
Unit
°C
°C
°C
°C
°C
°C
W
W
1
1
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