ATMEGA1280-16CU Atmel, ATMEGA1280-16CU Datasheet - Page 4

• Manufacturer Part Number: ATMEGA1280-16CU
• Description: IC MCU AVR 128K FLASH 100-CBGA
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA1280-16CU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 86
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFBGA
• Processor Series: ATMEGA128x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 8 KB
• Interface Type: 2-Wire, SPI, USART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 86
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATAVRRZ541, ATAVRRAVEN, ATAVRRZRAVEN, ATAVRRZUSBSTICK, ATAVRISP2, ATAVRRZ201
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Package: 100CBGA
• Device Core: AVR
• Family Name: ATmega
• Maximum Speed: 16 MHz
• Operating Supply Voltage: 3.3|5 V
• For Use With: ATSTK600-TQFP100 - STK600 SOCKET/ADAPTER 100-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK503 - STARTER KIT AVR EXP MODULE 100PATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 1-3.
2549MS–AVR–09/10
(RXD0/ PCINT8 /PDI) PE0
(ICP3/ CLKO /INT7) PE7
(OC2A/ PCINT4 ) PB4
(MOSI/ PCINT2 ) PB2
(MISO/ PCINT3 ) PB3
(OC1A/ PCINT5 ) PB5
(OC1B/ PCINT6 ) PB6
(SCK/ PCINT1 ) PB1
(OC3A/AIN1) PE3
(OC3C/INT5) PE5
(SS/ PCINT0 ) PB0
(OC3B/INT4) PE4
(XCK0/AIN0) PE2
(TXD0/PDO) PE1
(T3/INT6) PE6
Pinout ATmega1281/2561
(OC0B) PG5
Note:
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
The large center pad underneath the QFN/MLF package is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
ATmega640/1280/1281/2560/2561
ATmega1281/2561
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2 (ALE)
PC7 (A15 )
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1 (RD)
PG0 (WR)
4