ATMEGA1280-16CU Atmel, ATMEGA1280-16CU Datasheet - Page 30

• Manufacturer Part Number: ATMEGA1280-16CU
• Description: IC MCU AVR 128K FLASH 100-CBGA
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA1280-16CU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 86
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFBGA
• Processor Series: ATMEGA128x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 8 KB
• Interface Type: 2-Wire, SPI, USART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 86
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATAVRRZ541, ATAVRRAVEN, ATAVRRZRAVEN, ATAVRRZUSBSTICK, ATAVRISP2, ATAVRRZ201
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Package: 100CBGA
• Device Core: AVR
• Family Name: ATmega
• Maximum Speed: 16 MHz
• Operating Supply Voltage: 3.3|5 V
• For Use With: ATSTK600-TQFP100 - STK600 SOCKET/ADAPTER 100-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK503 - STARTER KIT AVR EXP MODULE 100PATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.4
10.5
10.6
10.7
10.8
2549MS–AVR–09/10
ATmega2560 rev. E
ATmega2560 rev. D
ATmega2560 rev. C
ATmega2560 rev. B
ATmega2560 rev. A
2. High current consumption in sleep mode
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1. High current consumption in sleep mode
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1.
2. Part does not work under 2.4 volts
High current consumption in sleep mode.
Non-Read-While-Write area of flash not functional.
Part does not work under 2.4 volts.
Incorrect ADC reading in differential mode.
Internal ADC reference has too low value.
IN/OUT instructions may be executed twice when Stack is in external RAM.
EEPROM read from application code does not work in Lock Bit Mode 3.
If a pending interrupt cannot wake the part up from the selected sleep mode, the current
consumption will increase during sleep when executing the SLEEP instruction directly after
a SEI instruction.
Problem Fix/Workaround
Before entering sleep, interrupts not used to wake the part from the sleep mode should be
disabled.
No known errata.
Not sampled.
If a pending interrupt cannot wake the part up from the selected sleep mode, the current
consumption will increase during sleep when executing the SLEEP instruction directly after
a SEI instruction.
Problem Fix/Workaround
Before entering sleep, interrupts not used to wake the part from the sleep mode should be
disabled.
Not sampled.
The Non-Read-While-Write area of the flash is not working as expected. The problem is
related to the speed of the part when reading the flash of this area.
Problem Fix/Workaround
- Only use the first 248K of the flash.
- If boot functionality is needed, run the code in the Non-Read-While-Write area at maximum
1/4th of the maximum frequency of the device at any given voltage. This is done by writing
the CLKPR register before entering the boot section of the code.
The part does not execute code correctly below 2.4 volts.
Non-Read-While-Write area of flash not functional
ATmega640/1280/1281/2560/2561
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