PIC16F877-20/L Microchip Technology, PIC16F877-20/L Datasheet - Page 193

IC MCU FLASH 8KX14 EE 44PLCC

PIC16F877-20/L

Manufacturer Part Number
PIC16F877-20/L
Description
IC MCU FLASH 8KX14 EE 44PLCC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F877-20/L

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
44-PLCC
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/PSP/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
8-ch x 10-bit
Data Rom Size
256 B
Height
3.87 mm
Length
16.59 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
16.59 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164309 - MODULE SKT FOR PM3 44PLCC444-1001 - DEMO BOARD FOR PICMICRO MCUDVA16XL441 - ADAPTER DEVICE ICE 44PLCC309-1040 - ADAPTER 44-PLCC ZIF TO 40-DIP309-1039 - ADAPTER 44-PLCC TO 40-DIPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F877-20/L
Manufacturer:
MICROCHI
Quantity:
27
Part Number:
PIC16F877-20/L
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F877-20/L
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
2001 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
6.99
3.18
0.20
8.13
7.62
1.02
0.41
5
5
MILLIMETERS
PIC16F87X
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
DS30292C-page 191
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15

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