DSPIC30F5013-20I/PT Microchip Technology, DSPIC30F5013-20I/PT Datasheet - Page 164

• Manufacturer Part Number: DSPIC30F5013-20I/PT
• Description: IC DSPIC MCU/DSP 66K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5013-20I/PT

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 66KB (22K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TFQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 68
• Flash Memory Size: 66KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 68
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F501320IPT

dsPIC30F5011/5013
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70116J-page 164
dsPIC30F501x-30I
dsPIC30F501x-20I
dsPIC30F501x-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Note 1:
V
4.75-5.5V
4.75-5.5V
DD
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
Range
P
INT
Junction to ambient thermal resistance, Theta-ja (
P
I
/
O
=
=
V
∑
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
(
{
V
×
DD
⎛
⎝
-40°C to 125°C
-40°C to 125°C
I
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Temp Range
–
D D
Characteristic
V
–
O H
∑
Rating
} I
I
×
OH
⎞
⎠
OH
)
+
∑
(
V
dsPIC30F501X-30I
OL
×
I
O L
)
7.5
30
15
—
—
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
dsPIC30F501X-20I
DMAX
θ
θ
P
T
T
T
T
T
T
A
A
A
JA
JA
D
J
J
J
Max MIPS
7.5
20
10
—
—
Min
Typ
-40
-40
-40
-40
-40
-40
39
39
(T
© 2011 Microchip Technology Inc.
P
J
INT
- T
Max
Typ
—
—
—
—
—
—
—
—
+ P
A
) /
dsPIC30F501X-20E
I
θ
/
O
JA
°C/W
°C/W
+125
+150
+150
+125
Max
Unit
+85
+85
20
10
—
—
—
Notes
Unit
°C
°C
°C
°C
°C
°C
W
W
1
1