DSPIC33FJ128GP710-I/PF Microchip Technology, DSPIC33FJ128GP710-I/PF Datasheet - Page 306
![IC DSPIC MCU/DSP 128K 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
DSPIC33FJ128GP710-I/PF
Manufacturer Part Number
DSPIC33FJ128GP710-I/PF
Description
IC DSPIC MCU/DSP 128K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
2.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
3.DSPIC33FJ64GP206-IPT.pdf
(28 pages)
Specifications of DSPIC33FJ128GP710-I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Core Frequency
40MHz
Core Supply Voltage
3.6V
No. Of I/o's
85
Flash Memory Size
128KB
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ128GP710-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC33FJ12GP201-ISO PDF datasheet
- DSPIC33FJ64GP206-IPT PDF datasheet #2
- DSPIC33FJ64GP206-IPT PDF datasheet #3
- Current page: 306 of 322
- Download datasheet (5Mb)
dsPIC33FJXXXGPX06/X08/X10
DS70286C-page 304
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
e
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
NOTE 2
E1
L
Units
A2
A1
E1
D1
L1
N
A
E
D
e
L
c
b
E
A1
A
0.95
0.05
0.45
0.17
MIN
0.09
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
© 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
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