DSPIC33FJ128GP710-I/PF Microchip Technology, DSPIC33FJ128GP710-I/PF Datasheet - Page 260
![IC DSPIC MCU/DSP 128K 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
DSPIC33FJ128GP710-I/PF
Manufacturer Part Number
DSPIC33FJ128GP710-I/PF
Description
IC DSPIC MCU/DSP 128K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
2.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
3.DSPIC33FJ64GP206-IPT.pdf
(28 pages)
Specifications of DSPIC33FJ128GP710-I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Core Frequency
40MHz
Core Supply Voltage
3.6V
No. Of I/o's
85
Flash Memory Size
128KB
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ128GP710-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC33FJ12GP201-ISO PDF datasheet
- DSPIC33FJ64GP206-IPT PDF datasheet #2
- DSPIC33FJ64GP206-IPT PDF datasheet #3
- Current page: 260 of 322
- Download datasheet (5Mb)
dsPIC33FJXXXGPX06/X08/X10
25.1
TABLE 25-1:
TABLE 25-2:
TABLE 25-3:
DS70286C-page 258
DC5
dsPIC33FJXXXGPX06/X08/X10
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Note 1:
Characteristic
Operating Junction Temperature Range
DC Characteristics
P
I/O =
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
({V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
OH
Characteristic
-
Range
} x I
I
Rating
OH
OH
)
) +
(V
OL
x I
OL
)
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
dsPIC33FJXXXGPX06/X08/X10
Min
Typ
-40
-40
40
40
40
40
(T
© 2009 Microchip Technology Inc.
P
INT
J
- T
Max
Typ
Max MIPS
—
—
—
—
—
—
+ P
A
)/
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
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