DSPIC33FJ256GP510-I/PF Microchip Technology, DSPIC33FJ256GP510-I/PF Datasheet - Page 79

• Manufacturer Part Number: DSPIC33FJ256GP510-I/PF
• Description: IC DSPIC MCU/DSP 256K 100TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ256GP510-I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 3.3V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 85
• Flash Memory Size: 256KB
• Supply Voltage Range: 3V To 3.6V
• Package: 100TQFP
• Device Core: dsPIC
• Family Name: dSPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 85
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 32-chx10-bit|32-chx12-bit
• Number Of Timers: 9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

APPENDIX E:
Revision C (June 2006)
• Added code protection Configuration register
• Added information about Unit ID
• Added ERASES, ERASEG and ERASEC
• Added checksum computation equation
Revision D (March 2007)
• Added information specific to the
• Added specific checksum computations for all
• Updated ICSP bulk/page erase and row/byte
• Added the P20 timing characteristic
• Updated timing characteristics and references to
• Updated the ICSP code examples
© 2010 Microchip Technology Inc.
descriptions
programming executive commands
dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/
202 and PIC24HJ12GP201/202 devices in sev-
eral sections, including pinout diagrams, program
memory sizes and Device ID values
dsPIC33F and PIC24H devices
program code examples to show externally timed
operation (waiting for specific delay periods)
the timing characteristics
REVISION HISTORY
Revision E (June 2007)
• Removed list of devices from first page. This
• Added information specific to the following new
• Updated paragraph in
• Renamed Table 2-1 to “Pins Used During
• Reordered list of devices in Table 2-2, Table 3-2
• Removed all pin diagrams
• Updated checksum information in Table 3-2 for
• Added a Note to
• Changed bit 5 of the FOSCSEL register to
• Modified the first paragraph of
• Added
document covers all released dsPIC33F/PIC24H
devices, therefore, references to specific devices
are included when applicable
devices in several sections, including program
memory sizes, Configuration bit descriptions,
checksum computations, Configuration registers,
and Device ID values:
- dsPIC33FJ32GP202
- dsPIC33FJ32GP204
- dsPIC33FJ16GP304
- dsPIC33FJ32MC202
- dsPIC33FJ32MC204
- dsPIC33FJ16MC304
- PIC24HJ32GP202
- PIC24HJ32GP204
- PIC24HJ16GP304
During Programming”
location of complete pin diagrams
Programming”
and Table 7-1 by device family and memory size
the following devices:
- dsPIC33FJ12GP201
- dsPIC33FJ12GP202
- dsPIC33FJ12MC201
- dsPIC33FJ12MC201
- PIC24HJ12GP201
- PIC24HJ12GP202
unimplemented ( — ) in Table 3-4
“Programming Methodology”
Appendix A: “Hex File Format”
Section 3.6.1 “Overview”
Section 2.3 “Pins Used
to include reference to
Section 3.6.2
DS70152H-page 79