DSPIC33FJ256GP510-I/PF Microchip Technology, DSPIC33FJ256GP510-I/PF Datasheet - Page 43

IC DSPIC MCU/DSP 256K 100TQFP

DSPIC33FJ256GP510-I/PF

Manufacturer Part Number
DSPIC33FJ256GP510-I/PF
Description
IC DSPIC MCU/DSP 256K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ256GP510-I/PF

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
85
Flash Memory Size
256KB
Supply Voltage Range
3V To 3.6V
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
85
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
32-chx10-bit|32-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ256GP510-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
Table 5-7
shows the ICSP programming details for
clearing the Configuration registers. In Step 1, the
Reset vector is exited. In Step 2, the write pointer (W7)
is loaded with 0x0000, which is the original destination
address (in TBLPAG, 0xF8 of program memory). In
Step 3, the NVMCON is set to program one
Configuration register. In Step 4, the TBLPAG register
is initialized to 0xF8 for writing to the Configuration
registers. In Step 5, the value to write to each
Configuration register is loaded to W0. In Step 6, the
Configuration register data is written to the write latch
using the TBLWTL instruction. In Steps 7 and 8, the
programming cycle is initiated. In Step 9, the internal
PC is set to 0x200 as a safety measure to prevent the
PC from incrementing into unimplemented memory.
Lastly, Steps 4-9 are repeated until all twelve
Configuration registers are written.
© 2010 Microchip Technology Inc.
DS70152H-page 43

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