PIC32MX360F256L-80I/PT Microchip Technology, PIC32MX360F256L-80I/PT Datasheet - Page 32
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PIC32MX360F256L-80I/PT
Manufacturer Part Number
PIC32MX360F256L-80I/PT
Description
IC PIC MCU FLASH 256K 100-TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.MA320002.pdf
(208 pages)
2.DM320001.pdf
(44 pages)
3.PIC32MX320F032H-40IPT.pdf
(48 pages)
4.PIC32MX320F032H-40IPT.pdf
(66 pages)
5.PIC32MX320F032H-40IPT.pdf
(22 pages)
6.PIC32MX320F032H-40IPT.pdf
(626 pages)
7.PIC32MX320F064H-40IMR.pdf
(172 pages)
Specifications of PIC32MX360F256L-80I/PT
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-TFQFP
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC32MX3xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C , SPI , UART
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
85
Number Of Timers
5 x 16 bit
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320001, DM320002, MA320001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Controller Family/series
PIC32
No. Of I/o's
85
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
6
Embedded Interface Type
EUART, I2C, PSP, SPI
No. Of Pwm Channels
5
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARDAC244003 - TEST BD MPLAB REAL ICE LOOPBACKAC244006 - KIT MPLAB REAL ICE TRACEDM320001 - KIT EVAL PIC32 STARTERAC164333 - MODULE SKT FOR PM3 100QFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX360F256L-80I/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
PIC32MX360F256L-80I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC32MX360F256L-80I/PT
Manufacturer:
MICROCHI
Quantity:
20 000
PIC32MX3XX/4XX
FIGURE 2-1:
2.2.1
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47 µF. This capacitor should be located as close to
the device as possible.
2.3
2.3.1
A low-ESR (< 1 Ohm) capacitor is required on the
V
internal voltage regulator output. The V
pin must not be connected to V
C
ground. The type can be ceramic or tantalum. Refer to
Section 29.0
additional information on C
mode is enabled by connecting the ENVREG pin to
V
2.3.2
In this mode the core voltage is supplied externally
through the VDDCORE pin. A low-ESR capacitor of
10 µF is recommended on the V
is enabled by grounding the ENVREG pin.
The placement of this capacitor should be close to the
V
length not exceed one-quarter inch (6 mm). Refer to
Section 26.3 “On-Chip Voltage Regulator” for
details.
DS61143G-page 32
CAP
DD
CAP
EFC
0.1 µF
Ceramic
C
V
BP
DD
.
R
/V
/V
C
capacitor, with at least a 6V rating, connected to
DDCORE
DDCORE
R1
Capacitor on Internal Voltage
Regulator (V
BULK CAPACITORS
INTERNAL REGULATOR MODE
EXTERNAL REGULATOR MODE
10 Ω
MCLR
V
V
SS
DD
. It is recommended that the trace
“Electrical
pin, which is used to stabilize the
RECOMMENDED
MINIMUM CONNECTION
PIC32MX
C
CAP
EFC
0.1 µF
Ceramic
C
BP
EFC
/V
Characteristics”
DDCORE
DD
DDCORE
specifications. This
, and must have a
pin. This mode
V
V
CAP
DD
SS
0.1 µF
Ceramic
C
0.1 µF
Ceramic
C
)
BP
BP
/V
0.1 µF
Ceramic
C
BP
DDCORE
for
2.4
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device Programming and Debugging
Pulling The MCLR pin low generates a device reset.
Figure 2-2 illustrates a typical MCLR circuit. During
device programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR pin. Consequently, specific voltage
levels (V
not be adversely affected. Therefore, specific values
of R and C will need to be adjusted based on the
application and PCB requirements.
For example, as illustrated in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
Note 1: R ≤ 10 kΩ is recommended. A suggested
2: R1 ≤ 470Ω will limit any current flowing into
3: The capacitor can be sized to prevent uninten-
Master Clear (MCLR) Pin
IH
starting value is 10 kΩ. Ensure that the MCLR
pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
tional resets from brief glitches or to extend the
device reset period during POR.
and V
V
IH
DD
R
and V
JP
C
IH
IL
and V
) and fast signal transitions must
IL
specifications are met.
EXAMPLE OF MCLR PIN
CONNECTIONS
R1
IL
© 2010 Microchip Technology Inc.
specifications are met.
MCLR
PIC32MX