PIC18F452-I/P Microchip Technology, PIC18F452-I/P Datasheet - Page 165
![IC MCU FLASH 16KX16 EE 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F452-I/P
Manufacturer Part Number
PIC18F452-I/P
Description
IC MCU FLASH 16KX16 EE 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F242-ISO.pdf
(332 pages)
3.PIC18F242-ISO.pdf
(14 pages)
4.PIC18F242-ISO.pdf
(16 pages)
5.PIC18F242-ISO.pdf
(16 pages)
6.PIC18F242-ISO.pdf
(14 pages)
7.PIC18LF242-ISO.pdf
(36 pages)
8.PIC18F452-EP.pdf
(332 pages)
Specifications of PIC18F452-I/P
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP/SPI/I2C/PSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
PIC18F452I/P
Q1176145
Q1176145
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15.4.17.3
Bus collision occurs during a STOP condition if:
a)
b)
FIGURE 15-31:
FIGURE 15-32:
2002 Microchip Technology Inc.
After the SDA pin has been de-asserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is de-asserted, SCL is
sampled low before SDA goes high.
SDA
SCL
PEN
BCLIF
P
SSPIF
SSPIF
BCLIF
SDA
PEN
SCL
Bus Collision During a STOP
Condition
P
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
Assert SDA
T
SDA asserted low
BRG
T
BRG
T
BRG
T
BRG
The STOP condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the baud rate generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ’0’ (Figure 15-31). If the SCL pin is sampled
low before SDA is allowed to float high, a bus collision
occurs. This is another case of another master
attempting to drive a data ’0’ (Figure 15-32).
SCL goes low before SDA goes high
Set BCLIF
T
BRG
T
BRG
PIC18FXX2
’0’
’0’
DS39564B-page 163
SDA sampled
low after T
Set BCLIF
’0’
’0’
BRG
,