PIC16LF876-04/SO Microchip Technology, PIC16LF876-04/SO Datasheet - Page 196

• Manufacturer Part Number: PIC16LF876-04/SO
• Description: IC MCU FLASH 8KX14 EE A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF876-04/SO

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC16LF
• No. Of I/o's: 24
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 368Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 22
• Interface Type: I2C/SPI/USART
• On-chip Adc: 5-chx10-bit
• Number Of Timers: 3
• Processor Series: PIC16LF
• Core: PIC
• Data Ram Size: 368 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC16F87X
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS30292C-page 194
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
A1
E1
n1
E
D
B
n
p
A
L
c
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
NOM
2001 Microchip Technology Inc.
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
44
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7