PIC24FJ128GA110-I/PT Microchip Technology, PIC24FJ128GA110-I/PT Datasheet - Page 27

• Manufacturer Part Number: PIC24FJ128GA110-I/PT
• Description: IC PIC MCU FLASH 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ128GA110-I/PT

• Core Size: 16-Bit
• Program Memory Size: 128KB (43K x 24)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFQFP
• Controller Family/series: PIC24
• No. Of I/o's: 85
• Ram Memory Size: 16KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDMA240015 - BOARD MCV PIM FOR 24F256GADM240011 - KIT STARTER MPLAB FOR PIC24F MCU
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 8.0 “Oscillator Configuration”
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins, and other
signals in close proximity to the oscillator, are benign
(i.e., free of high frequencies, short rise and fall times
and other similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
• AN849, “Basic PICmicro
• AN943, “Practical PICmicro
• AN949, “Making Your Oscillator Work”
 2010 Microchip Technology Inc.
Selection for rfPIC™ and PICmicro
and Design”
External Oscillator Pins
secondary
®
Oscillator Design”
®
oscillator
Oscillator Analysis
Figure
®
Devices”
for details).
2-5. In-line
(refer
PIC24FJ256GA110 FAMILY
to
FIGURE 2-5:
(tied to ground)
Bottom Layer
Copper Pour
Oscillator
Secondary
Primary
Oscillator
Crystal
GND
OSCO
OSCI
C1
C2
Sec Oscillator: C1
DEVICE PINS
(tied to ground)
Single-Sided and In-line Layouts:
Copper Pour
Fine-Pitch (Dual-Sided) Layouts:
`
`
Top Layer Copper Pour
SUGGESTED
PLACEMENT OF THE
OSCILLATOR CIRCUIT
(tied to ground)
`
Primary Oscillator
Sec Oscillator: C2
Crystal
DEVICE PINS
DS39905E-page 27
C2
C1
OSCI
OSCO
GND
SOSCO
SOSC I
Oscillator
Crystal