DSPIC30F4013-30I/P Microchip Technology, DSPIC30F4013-30I/P Datasheet - Page 231
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DSPIC30F4013-30I/P
Manufacturer Part Number
DSPIC30F4013-30I/P
Description
IC DSPIC MCU/DSP 48K 40DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20IP.pdf
(26 pages)
2.DSPIC30F3014-30IPT.pdf
(228 pages)
3.DSPIC30F3014-30IPT.pdf
(16 pages)
4.DSPIC30F3014-30IPT.pdf
(6 pages)
5.DSPIC30F3014-30IPT.pdf
(14 pages)
6.DSPIC30F3014-30IPT.pdf
(20 pages)
7.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F4013-30I/P
Program Memory Type
FLASH
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, POR, PWM, WDT
Number Of I /o
30
Program Memory Size
48KB (16K x 24)
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Data Rom Size
1024 B
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F003 - MODULE SOCKET DSPIC30F 40DIPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F4013-30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F4013-30I/P
Manufacturer:
Microchip
Quantity:
3 183
Part Number:
DSPIC30F4013-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
DSPIC30F4013-30I/PT
Manufacturer:
MICROCHIP
Quantity:
1 600
Company:
Part Number:
DSPIC30F4013-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F4013-30I/PT
Manufacturer:
MICR0CHIP
Quantity:
20 000
64-Lead Plastic Thin Quad Flatpack 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
2004 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
β
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
(F)
n
p
E
D
B
α
A
φ
c
β
L
L
n
MIN
2
1
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
.039
Preliminary
0
5
5
D1
φ
CH x 45°
INCHES
D
NOM
.024
.394
.394
.020
.043
.039
.006
.039
.472
.472
.007
.009
.035
A1
3.5
16
64
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.041
.011
.045
15
15
7
(F)
MIN
11.75
11.75
0.64
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
5
5
0
MILLIMETERS*
NOM
dsPIC30F
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
64
16
10
10
DS70082G-page 229
A2
MAX
α
12.25
12.25
10.10
10.10
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7