PIC24HJ128GP506-I/PT Microchip Technology, PIC24HJ128GP506-I/PT Datasheet - Page 2

• Manufacturer Part Number: PIC24HJ128GP506-I/PT
• Description: IC PIC MCU FLASH 64KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ128GP506-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (43K x 24)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: CAN/I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 18-ch x 12-bit
• Height: 1 mm
• Length: 10 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 10 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24H ENGINEERING SAMPLES
10. 12-bit ADC Module
11. 10-bit ADC Module
12. DMA Module: Interaction with EXCH Instruction
13. DISI Instruction
14. JTAG Programming
DS80260B-page 2
For this revision of silicon, the 12-bit ADC module
INL and DNL, conversion speed and signal acqui-
sition time parameters are not within the published
data sheet specifications.
For this revision of silicon, the 10-bit ADC module
INL, DNL and signal acquisition time parameters
are not within the published data sheet
specifications.
The EXCH instruction does not execute correctly
when one of the operands contains a value equal
to the address of the DMAC SFRs.
The DISI instruction will not disable interrupts if a
DISI instruction is executed in the same instruc-
tion cycle that the DISI counter decrements to
zero.
JTAG programming will not work in silicon revision
A0/A1.
15. Internal FRC Oscillator
16. ECAN™ Loopback Mode
17. Clock Switch From Fail-Safe Clock Source
18. I
The following sections will describe the errata and work
around to these errata, where they may apply.
The internal FRC oscillator is not calibrated in
silicon revision A0/A1.
The ECAN module (ECAN1 or ECAN2) does not
function correctly in Loopback mode.
Once a clock fail interrupt has occurred, the clock
source cannot be switched from the fail-safe clock
source.
The I
when it detects bus activity.
2
C™ Module
2
C module does not wake-up from Sleep
© 2006 Microchip Technology Inc.