PIC24FJ128GB106-I/PT Microchip Technology, PIC24FJ128GB106-I/PT Datasheet - Page 296
![IC PIC MCU FLASH 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC24FJ128GB106-I/PT
Manufacturer Part Number
PIC24FJ128GB106-I/PT
Description
IC PIC MCU FLASH 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA106-IPT.pdf
(52 pages)
2.PIC24FJ64GB106-IPT.pdf
(16 pages)
3.PIC24FJ64GB106-IPT.pdf
(352 pages)
4.PIC24FJ192GB108-IPT.pdf
(328 pages)
Specifications of PIC24FJ128GB106-I/PT
Core Size
16-Bit
Program Memory Size
128KB (43K x 24)
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Number Of I /o
51
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC24
No. Of I/o's
51
Ram Memory Size
16KB
Cpu Speed
32MHz
No. Of Timers
5
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
52
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Package
64TQFP
Device Core
PIC
Family Name
PIC24
Maximum Speed
32 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM183026 - KIT EVALUATION PIC16F/PIC24FDM240011 - KIT STARTER MPLAB FOR PIC24F MCUMA240014 - MODULE PLUG-IN PIC24
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ128GB106-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24FJ128GA106-IPT PDF datasheet
- PIC24FJ64GB106-IPT PDF datasheet #2
- PIC24FJ64GB106-IPT PDF datasheet #3
- PIC24FJ192GB108-IPT PDF datasheet #4
- Current page: 296 of 328
- Download datasheet (6Mb)
PIC24FJ256GB110 FAMILY
28.1
FIGURE 28-1:
TABLE 28-1:
TABLE 28-2:
DS39897B-page 294
PIC24FJ256GB110 family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 14x14x1 mm TQFP
Package Thermal Resistance, 12x12x1 mm TQFP
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
For frequencies between 16 MHz and 32 MHz, F
Note 1:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= Σ ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
When the voltage regulator is disabled, V
V
x (I
DD
DDCORE
3.00V
2.75V
2.50V
2.25V
2.00V
PIC24FJ256GB110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– Σ I
OH
} x I
≤ V
Rating
OH
DD
OH
)
16 MHz
) + Σ (V
≤ 3.6V.
OL
x I
OL
Preliminary
PIC24FJXXXGB1XX
)
Frequency
MAX
JA
DD
(θ
= (64 MHz/V) * (V
JA
and V
) numbers are achieved by package simulations.
Symbol
Symbol
P
DDCORE
DMAX
θ
θ
θ
P
T
T
JA
JA
JA
A
D
J
must be maintained so that
DDCORE
50.0
69.4
76.6
Min
Typ
-40
-40
(T
© 2008 Microchip Technology Inc.
P
32 MHz
– 2V) + 16 MHz.
J
INT
– T
Max
Typ
—
—
—
—
—
+ P
A
)/θ
2.75V
2.25V
I
/
O
JA
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W
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