PIC16F777-I/P Microchip Technology, PIC16F777-I/P Datasheet - Page 44
![IC PIC MCU FLASH 8KX14 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F777-I/P
Manufacturer Part Number
PIC16F777-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F777-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
MIC
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
ATMEL
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 44 of 276
- Download datasheet (6Mb)
PIC16F7X7
4.7.2
The core and peripherals can be configured to be
clocked by T1OSC using a 32.768 kHz crystal. The
crystal must be connected to the T1OSO and T1OSI
pins. This is the same configuration as the low-power
timer circuit (see Section 7.6 “Timer1 Oscillator”).
When SCS bits are configured to run from T1OSC, a
clock transition is generated. It will clear the OSTS bit,
switch the system clock from either the primary system
clock or INTRC, depending on the value of SCS<1:0>
and FOSC<2:0>, to the external low-power Timer1
oscillator input (T1OSC) and shut-down the primary
system clock to conserve power.
After a clock switch has been executed, the internal Q
clocks are held in the Q1 state until eight falling edge
clocks are counted on the T1OSC. After the eight clock
periods have transpired, the clock input to the Q clocks
is released and operation resumes (see Figure 4-8). In
addition, T1RUN (in T1CON) is set to indicate that
T1OSC is being used as the system clock.
FIGURE 4-8:
DS30498C-page 42
SCS<1:0>
Note 1:
Program
Counter
System
T1OSI
OSC1
Clock
2:
3:
4:
T
T
T
T
OSC
SCS
T
DLY
Q1
SEC_RUN MODE
1
T
P
OSC (2)
= 8 T
= 1 T
Q2
= 30.52 s.
= 50 ns minimum.
PC
Q3
T
T
1
1
P
P
.
Q4
TIMING DIAGRAM FOR SWITCHING TO SEC_RUN MODE
Q1
T
DLY
(4)
T
T
1
P
(1)
T
SCS (3)
PC + 1
Note 1: The T1OSCEN bit must be enabled and it
Q1
2: When T1OSCEN = 0, the following
Q2
A clock switching event will occur if the
final state of the SCS bits is different from
the original.
is the user’s responsibility to ensure
T1OSC is stable before clock switching to
the T1OSC input clock can occur.
possible effects result.
SCS<1:0>
Original
00
00
10
10
Q3
Q4
2004 Microchip Technology Inc.
SCS<1:0>
Modified
Q1
01
11
11
01
Q2
PC + 2
00 – no change
10 – INTRC
10 – no change
00 – Oscillator
defined by
FOSC<2:0>
Q3
SCS<1:0>
Final
Q4
PC + 3
Q1
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