PIC16F777-I/P Microchip Technology, PIC16F777-I/P Datasheet - Page 238
![IC PIC MCU FLASH 8KX14 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F777-I/P
Manufacturer Part Number
PIC16F777-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F777-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART/CCP/I2C/MSSP/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
MIC
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/P
Manufacturer:
ATMEL
Quantity:
5 510
Company:
Part Number:
PIC16F777-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 238 of 276
- Download datasheet (6Mb)
PIC16F7X7
FIGURE 18-20:
TABLE 18-16: A/D CONVERSION REQUIREMENTS
DS30498C-page 236
130
131
132
134
Note 1:
Param
No.
Note: If the A/D clock source is selected as RC, a time of T
A/D DATA
SAMPLE
A/D CLK
2:
ADRES
*
†
§
T
T
T
T
Symbol
BSF ADCON0, GO
AD
CNV
ACQ
GO
ADIF
GO
These parameters are characterized but not tested.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
This specification ensured by design.
ADRES register may be read on the following T
See Section 12.1 “A/D Acquisition Requirements” for minimum conditions.
Q4
instruction to be executed.
A/D Clock Period
Conversion Time (not including S/H time)
(Note 1)
Acquisition Time
Q4 to A/D Clock Start
132
A/D CONVERSION TIMING
Characteristic
(T
OSC
/2)
9
(1)
PIC16F7X7
PIC16LF7X7
PIC16F7X7
PIC16LF7X7
8
OLD_DATA
Sampling Stopped
7
CY
(Note 2)
cycle.
CY
Min
10*
1.6
3.0
2.0
3.0
—
is added before the A/D clock starts. This allows the SLEEP
130
131
T
OSC
Typ†
4.0
6.0
40
—
—
—
—
/2 §
2
Max
6.0
9.0
—
—
12
—
—
—
1
Units
T
—
AD
s
s
s
s
s
s
1 T
0
2004 Microchip Technology Inc.
CY
T
T
A/D RC mode
A/D RC mode
The minimum time is the
amplifier settling time. This may
be used if the “new” input
voltage has not changed by
more than 1 LSb (i.e., 5.0 mV @
5.12V) from the last sampled
voltage (as stated on C
If the A/D clock source is
selected as RC, a time of T
added before the A/D clock
starts. This allows the SLEEP
instruction to be executed.
OSC
OSC
based, V
based, V
DONE
NEW_DATA
Conditions
REF
REF
3.0V
2.0V
HOLD
CY
).
is
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