ATMEGA165PV-8MU Atmel, ATMEGA165PV-8MU Datasheet - Page 2

• Manufacturer Part Number: ATMEGA165PV-8MU
• Description: IC AVR MCU 16K 8MHZ 64-QFN
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA165PV-8MU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SPI, UART/USART, USI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 512 x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-MLF®, 64-QFN
• Processor Series: ATMEGA16x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SPI, USART, USI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Package: 64QFN EP
• Device Core: AVR
• Family Name: ATmega
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• For Use With: ATSTK600-TQFP64 - STK600 SOCKET/ADAPTER 64-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1. Pin Configurations
Figure 1-1.
1.1
2
Disclaimer
(USCK/SCL/PCINT4) PE4
(XCK/AIN0/PCINT2) PE2
ATmega165P
(DI/SDA/PCINT5) PE5
(OC0A/PCINT12) PB4
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(CLKO/PCINT7) PE7
(AIN1/PCINT3) PE3
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
(SCK/PCINT9) PB1
Pinout ATmega165P
(DO/PCINT6) PE6
(SS/PCINT8) PB0
DNC
Note:
Typical values contained in this datasheet are based on simulations and characterization of
other AVR microcontrollers manufactured on the same process technology. Min and Max values
will be available after the device is characterized.
10
11
15
16
12
14
13
1
2
3
4
5
6
7
8
9
The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
39
38
34
33
48
47
44
43
42
41
40
37
35
46
45
36
8019KS–AVR–11/10
PA3
PA4
PA5
PA6
PA7
PG2
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PG1
PG0