PIC18F4331-I/PT Microchip Technology, PIC18F4331-I/PT Datasheet - Page 8

• Manufacturer Part Number: PIC18F4331-I/PT
• Description: IC PIC MCU FLASH 4KX16 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4331-I/PT

• Core Size: 8-Bit
• Program Memory Size: 8KB (4K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC18
• No. Of I/o's: 36
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART, I2C, SPI, SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 1 x 8
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9 bit
• Package: 44TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPI3-DB18F4431 - BOARD DAUGHTER ICEPIC3AC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
• Lead Free Status / Rohs Status: Details
• Other names: PIC18F4331-I/PTR; PIC18F4331-I/PTR

PIC18F2331/2431/4331/4431
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 109
11.0 Timer0 Module ......................................................................................................................................................................... 135
12.0 Timer1 Module ......................................................................................................................................................................... 139
13.0 Timer2 Module ......................................................................................................................................................................... 145
14.0 Timer5 Module ......................................................................................................................................................................... 147
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 153
16.0 Motion Feedback Module ......................................................................................................................................................... 159
17.0 Power Control PWM Module .................................................................................................................................................... 181
18.0 Synchronous Serial Port (SSP) Module ................................................................................................................................... 213
19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 223
20.0 10-Bit High-Speed Analog-to-Digital Converter (A/D) Module ................................................................................................. 245
21.0 Low-Voltage Detect .................................................................................................................................................................. 263
22.0 Special Features of the CPU .................................................................................................................................................... 269
23.0 Instruction Set Summary .......................................................................................................................................................... 289
24.0 Development Support............................................................................................................................................................... 331
25.0 Electrical Characteristics .......................................................................................................................................................... 335
26.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 371
27.0 Packaging Information.............................................................................................................................................................. 373
Appendix A: Revision History............................................................................................................................................................. 381
Appendix B: Device Differences......................................................................................................................................................... 381
Appendix C: Conversion Considerations ........................................................................................................................................... 382
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 382
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 383
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 383
Index .................................................................................................................................................................................................. 385
The Microchip Web Site ..................................................................................................................................................................... 395
Customer Change Notification Service .............................................................................................................................................. 395
Customer Support .............................................................................................................................................................................. 395
Reader Response .............................................................................................................................................................................. 396
Product Identification System............................................................................................................................................................. 397
DS39616C-page 6
Device Overview .......................................................................................................................................................................... 9
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 47
Memory Organization ................................................................................................................................................................. 59
Flash Program Memory .............................................................................................................................................................. 77
Data EEPROM Memory ............................................................................................................................................................. 87
8 x 8 Hardware Multiplier............................................................................................................................................................ 91
Interrupts .................................................................................................................................................................................... 93
Preliminary
© 2007 Microchip Technology Inc.