DSPIC33FJ32MC304-E/ML Microchip Technology, DSPIC33FJ32MC304-E/ML Datasheet - Page 343
![IC DSPIC MCU/DSP 32K 44-QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
DSPIC33FJ32MC304-E/ML
Manufacturer Part Number
DSPIC33FJ32MC304-E/ML
Description
IC DSPIC MCU/DSP 32K 44-QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
2.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
3.DSPIC33FJ64MC202-ESO.pdf
(424 pages)
Specifications of DSPIC33FJ32MC304-E/ML
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
44-QFN
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
35
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 9x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
35
Data Ram Size
4 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM330021, MA330018
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32MC304-E/ML
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC33FJ32MC304-E/ML
Manufacturer:
MICROCHIP
Quantity:
12 000
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC302-ISO PDF datasheet #2
- DSPIC33FJ64MC202-ESO PDF datasheet #3
- Current page: 343 of 424
- Download datasheet (6Mb)
31.0
This section provides an overview of dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/
X04 electrical characteristics. Additional information will be provided in future revisions of this document as it becomes
available.
Absolute maximum ratings for the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/
X04 family are listed below. Exposure to these maximum rating conditions for extended periods may affect device
reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the
operation listings of this specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on any pin that is not 5V tolerant with respect to V
Voltage on any 5V tolerant pin with respect to V
Voltage on any 5V tolerant pin with respect to Vss when V
Voltage on V
Maximum current out of V
Maximum current into V
Maximum output current sunk by any I/O pin
Maximum output current sourced by any I/O pin
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports
© 2009 Microchip Technology Inc.
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
2: Maximum allowable current is a function of device maximum power dissipation (see Table 31-2).
3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the V
4: See the “Pin Diagrams” section for 5V tolerant pins.
ELECTRICAL CHARACTERISTICS
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
and PGEDx pins, which are able to sink/source 12 mA.
DD
CAP
with respect to V
/V
DDCORE
DD
SS
with respect to V
pin
pin ...........................................................................................................................300 mA
(2)
...........................................................................................................................250 mA
SS
(1)
......................................................................................................... -0.3V to +4.0V
(2)
...............................................................................................................200 mA
SS
(3)
....................................................................................... 2.25V to 2.75V
........................................................................................................4 mA
SS
(3)
...................................................................................................4 mA
when V
Preliminary
SS
DD
DD
(4)
< 3.0V
≥ 3.0V
.................................................... -0.3V to (V
(4)
(4)
......................................... -0.3V to (V
.................................................. -0.3V to +5.6V
REF
+, V
REF
-, SCLx, SDAx, PGECx
DS70291D-page 343
DD
DD
+ 0.3V)
+ 0.3V)
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