PIC16LF873A-I/SP Microchip Technology, PIC16LF873A-I/SP Datasheet - Page 214

IC MCU FLASH 4KX14 EE A/D 28DIP

PIC16LF873A-I/SP

Manufacturer Part Number
PIC16LF873A-I/SP
Description
IC MCU FLASH 4KX14 EE A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets

Specifications of PIC16LF873A-I/SP

Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Oscillator Type
External
Core Processor
PIC
Speed
10MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC16LF
No. Of I/o's
22
Eeprom Memory Size
128Byte
Ram Memory Size
192Byte
Cpu Speed
20MHz
No.
RoHS Compliant
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC16LF873AI/SP
PIC16F87XA
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39582B-page 212
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
E1
D1
n1
A1
A
E
D
B
n
p
L
c
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
 2003 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
44
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7

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