T89C51CC02CA-TDSIM Atmel, T89C51CC02CA-TDSIM Datasheet - Page 26

IC 8051 MCU FLASH 16K 24SOIC

T89C51CC02CA-TDSIM

Manufacturer Part Number
T89C51CC02CA-TDSIM
Description
IC 8051 MCU FLASH 16K 24SOIC
Manufacturer
Atmel
Series
AT89C CANr

Specifications of T89C51CC02CA-TDSIM

Core Processor
8051
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
20
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
24-SOIC (7.5mm Width)
For Use With
AT89STK-06 - KIT DEMOBOARD 8051 MCU W/CAN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
T89C51CC02CATDSIM
Upper 128 Bytes RAM
Expanded RAM
26
T89C51CC02
Figure 10. Lower 128 Bytes Internal RAM Organization
The upper 128 Bytes of RAM are accessible from address 80h to FFh using only indirect
addressing mode.
The on-chip 256 Bytes of expanded RAM (XRAM) are accessible from address 0000h to
00FFh using indirect addressing mode through MOVX instructions. In this address
range.
Note:
Lower 128 Bytes RAM, Upper 128 Bytes RAM, and expanded RAM are made of volatile
memory cells. This means that the RAM content is indeterminate after power-up and
must then be initialized properly.
30h
20h
18h
10h
08h
00h
7Fh
2Fh
1Fh
0Fh
17h
07h
bit-Addressable Space
(bit Addresses 0-7Fh)
4 Banks of
8 Registers
R0-R7
4126F–CAN–12/03

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