DSPIC30F1010-30I/SP Microchip Technology, DSPIC30F1010-30I/SP Datasheet - Page 16

• Manufacturer Part Number: DSPIC30F1010-30I/SP
• Description: IC DSPIC MCU/DSP 6K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F1010-30I/SP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 6KB (2K x 24)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

FIGURE 7-2:
DS70284C-page 16
PGC
PGD
1
MSB X X X LSB
Last Command Word
PGC = Input
PGD = Input
2
Host Transmits
PROGRAMMING EXECUTIVE – PROGRAMMER COMMUNICATION PROTOCOL
15 16
P8
PGC = Input (Idle)
PGD = Output
Programming Executive
Processes Command
P9a
1
P9b
0
P10
1
MSB X X X LSB
2
Host Clocks Out Response
15 16
PGC = Input
PGD = Output
© 2010 Microchip Technology Inc.
P11
1
MSB X X X LSB
2
15 16