DSPIC30F3013-30I/SP Microchip Technology, DSPIC30F3013-30I/SP Datasheet - Page 49
DSPIC30F3013-30I/SP
Manufacturer Part Number
DSPIC30F3013-30I/SP
Description
IC DSPIC MCU/DSP 24K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F3012-20ISO.pdf
(14 pages)
4.DSPIC30F3012-20ISO.pdf
(20 pages)
5.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3013-30I/SP
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301330ISP
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20ISO PDF datasheet #2
- DSPIC30F3012-20ISO PDF datasheet #3
- DSPIC30F3012-20ISO PDF datasheet #4
- DSPIC30F3014-30IP PDF datasheet #5
- Current page: 49 of 244
- Download datasheet (7Mb)
4.4.2
The Modulo and Bit-Reversed Addressing Control reg-
ister MODCON<15:0> contains enable flags as well as
a W register field to specify the W address registers.
The XWM and YWM fields select which registers will
operate with modulo addressing. If XWM = 15, X RAGU
and X WAGU modulo addressing are disabled. Simi-
larly, if YWM = 15, Y AGU modulo addressing is dis-
abled.
FIGURE 4-1:
2004 Microchip Technology Inc.
Note:
Byte
Address
0x1100
0x1163
W ADDRESS REGISTER
SELECTION
The XMODSRT and XMODEND registers,
and the XWM register selection, are
shared between X RAGU and X WAGU.
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
INCREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
DO
MOV
AGAIN: INC
Preliminary
#0x1100,W0
W0, XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
#0x0000,W0
#0x1110,W1
AGAIN,#0x31
W0, [W1++]
W0,W0
The X Address Space Pointer W register (XWM) to
which modulo addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo addressing is
enabled for X data space when XWM is set to any value
other than 15 and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which modulo addressing is to be applied, is stored in
MODCON<7:4>. Modulo addressing is enabled for Y
data space when YWM is set to any value other than 15
and the YMODEN bit is set at MODCON<14>.
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;W0 holds buffer fill value
;point W1 to buffer
;fill the 50 buffer locations
;fill the next location
;increment the fill value
dsPIC30F
DS70082G-page 47
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